MAX26239/MAX26240

4.5V to 36V, 6A Buck-Boost Converters

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Absolute Maximum Ratings

SUP, EN to AGND .............................................. -0.3V to +42V

LX1 to PGND1 ......................................... -0.3V to VSUP +0.3V

LX2 to PGND2 ......................................... -0.3V to VOUT +0.3V

OUT to AGND ..................................................... -0.3V to +28V

BST1 to LX1, BST2 to LX2 ................................ -0.3V to +2.2V

BST1 to PGND1.................................................. -0.3V to +44V

BST2 to PGND2.................................................. -0.3V to +30V

VCC , SPS to AGND .......................................... -0.3V to +2.2V

COMP, FB to AGND ................................ -0.3V to VVCC +0.3V

PGND to AGND ................................................. -0.3V to +0.3V

SYNC, PGOOD to AGND......................................-0.3V to +6V

ESD Protection ..........................................................................

Human Body Model ......................................................±2kV

Machine Model .......................................................... ±100V

Continuous Power Dissipation (TA = +70°C, derate 30mW/°C

above +70°C).............................................................. 2404mW

Operating Junction Temperature.................... -40°C to +150°C

Storage Temperature Range ......................... -65°C to +150°C

Lead Temperature (soldering 10s) ...............................+300°C

Soldering Temperature (reflow).....................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

22 FC2QFN

Package Code

F224A4FY+1

Outline Number

21-100399

Land Pattern Number

90-100137

THERMAL PARAMETERS

4-LAYER JEDEC BOARD

4-LAYER EV KIT BOARD

Junction-to-Ambient Thermal Resistance (θJA)

33.3°C/W

22.4°C/W

Junction-to-Case (top) Thermal Resistance (θJCt)

6.8°C/W

—

Junction-to-Case (bottom) Thermal Resistance (θJCb)

6.4°C/W

7.5°C/W

Junction-to-Board Thermal Resistance (θJB)

7.6°C/W

9.6°C/W

Junction-to-Top Thermal Characterization Parameter (ΨJT)

3.3°C/W

3.3°C/W

Junction-to-Bottom Thermal Characterization Parameter (ΨJB)

8.5°C/W

9.4°C/W

For the latest package outline information and land patterns (footprints), go to the Package Index on the Analog Devices website.

Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character,

but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to Thermal Characterization of IC Packages.

Electrical Characteristics

(VSUP = VEN = 14V, TJ = -40°C to +150°C, unless otherwise noted. Typical values are at TA = +25°C. Note 1 and Note 2.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SUP INPUT SUPPLY

SUP Voltage Range

VSUP

Initial startup

4.5

36

V

Shutdown Supply

Current

ISUP_SHUTDO

WN

VEN = 0V, TA = +25°C

5

10

μA