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PIMXRT802VCVL4A Datasheet(PDF) 10 Page - NXP Semiconductors |
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PIMXRT802VCVL4A Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 119 page ![]() i.MX RT1060 Crossover Processors for Consumer Products, Rev. 4, 04/2024 10 NXP Semiconductors i.MX RT1060 Introduction Figure 1 describes the part number nomenclature so that characteristics of a specific part number can be identified (for example, cores, frequency, temperature grade, fuse options, and silicon revision). The primary characteristic which describes which data sheet applies to a specific part is the temperature grade (junction) field. MIMXRT106SDVL6B • 600 MHz, commercial grade for general purpose, with MPU/FPU • Turnkey solution for local voice (phoneme based) recognition, see www.nxp.com/mcu-local2 • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • Ethernet x2 • UART x8 • I2C x4 • FlexSPI x2 • CAN x2 • FlexCAN (with Flexible Data-Rate supported) • FlexIO x3 • 127 GPIOs (124 tightly coupled) • HAB/DCP/BEE • TRNG • SNVS • SJC • ADC x2 • ACMP x4 • TSC • DCDC • Temperature sensor • GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA 0 to +95 MIMXRT106VDVL6B MIMXRT106CDVL6B MIMXRT106DDVL6B MIMXRT106PDVL6B • 600 MHz, commercial • grade for general purpose, • with MPU/FPU • eDMA • Boot ROM (128 KB) • On-chip RAM (1 MB) • SEMC • GPT x2 • 4-channel PIT • Qtimer x4 • PWM x4 • ENC x4 • WDOG x4 • LCD/CSI/PXP • SPDIF x1 • SAI x3 • MQS x1 • USB OTG x2 • eMMC 4.5/SD 3.0 x2 • Ethernet x2 • UART x8 • I2C x4 • FlexSPI x2 • CAN x2 • FlexCAN (with Flexible • Data-Rate supported) • FlexIO x3 • 127 GPIOs (124 tightly • coupled) • HAB/DCP/BEE • TRNG • SNVS • SJC • ADC x2 • ACMP x4 • TSC • DCDC • Temperature sensor • GPC hardware power management controller 10 x 10 mm, 0.65 mm pitch, 196-pin MAPBGA 0 to +95 Table 1. Ordering information Part Number Features Package Junction Temperature Tj (C) |
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