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MIC2132 Datasheet(PDF) 37 Page - Microchip Technology

Part # MIC2132
Description  75V Dual Phase, Advanced COT Buck Controller, Stackable for Multiphase Operation
PDF  48 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC2132 Datasheet(HTML) 37 Page - Microchip Technology

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DS20006654B-page 37
MIC2132
The maximum recommended operating junction
temperature for the MIC2132 is +125°C. Using the out-
put voltage of the same switching converter when it is
between 4.7V (typical) and 14V, as the voltage at the
EXTVDD pin, significantly reduces the power dissipa-
tion inside the MIC2132. This reduces the junction
temperature rise as further illustrated.
For a typical case of VIN = 36V, VOUT = 5V, IG(TOTAL) =
20 mA, IQ = 5 mA and a maximum ambient temperature
of TA = +85°C when the EXTVDD is not used, the
MIC2132 junction temperature is calculated as shown
in Equation 5-43.
EQUATION 5-43:
When the EXTVDD is used and the 5V output of the
MIC2132 buck converter is used as the input to the
EXTVDD pin, the MIC2132 junction temperature is
calculated as shown in Equation 5-44. The junction
temperature is reduced significantly, from +115.6°C to
+89.3°C when the EXTVDD is used.
EQUATION 5-44:
5.9
Thermal Measurements
It is a good idea to measure the IC’s case temperature
to make sure it is within its operating limits. Although
this might seem an elementary task, it is easy to get
false results. The most common mistake is to use the
standard thermal couple that comes with a thermal
meter. This thermal couple wire gauge is large, typically
22 gauge, and behaves like a heatsink, which results in
a lower case temperature measurement.
There are two methods of temperature measurement:
using a smaller thermal couple wire or using an infrared
thermometer. If a thermal couple wire is used, it must
be constructed of 36 gauge wire or higher (smaller wire
size) to minimize the wire heatsinking effect. In addi-
tion, the thermal couple tip must be covered in either
thermal grease or thermal glue to ensure that the
thermal couple junction makes good contact with the
case of the IC. Wherever possible, an infrared
thermometer is recommended. The measurement spot
size of most infrared thermometers is too large for an
accurate reading on a small form factor IC. However,
an IR thermometer with a 1 mm spot size is a good
choice for measuring the hottest point on the case. An
optional stand can be used to make it easy to hold the
beam on the IC for long periods of time. In addition, a
more advanced, convenient and accurate infrared
thermal camera can be used, although such equipment
is much more expensive.
PIC = 36V × (20 mA + 5 mA)
PIC = 0.9W
TJ = 0.9W × 34ºC/W + 85ºC
TJ = 115.6ºC
PIC = 5V × (20 mA + 5 mA)
PIC = 0.125W
TJ = 0.125W × 34ºC/W + 85ºC
TJ = 89.3ºC



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