Si5367

Preliminary Rev. 0.3

13

4. Package Outline: 100-Pin TQFP

Figure 4 illustrates the package details for the Si5367. Table 4 lists the values for the dimensions shown in the

illustration.

Figure 4. 100-Pin Thin Quad Flat Package (TQFP)

Dimension

Min

Nom

Max

Dimension

Min

Nom

Max

A

—

—

1.20

E

16.00 BSC.

A1

0.05

—

0.15

E1

14.00 BSC.

A2

0.95

1.00

1.05

E2

3.85

4.00

4.15

b

0.17

0.22

0.27

L

0.45

0.60

0.75

c

0.09

—

0.20

aaa

—

—

0.20

D

16.00 BSC.

bbb

—

—

0.20

D1

14.00 BSC.

ccc

—

—

0.08

D2

3.85

4.00

4.15

ddd

—

—

0.08

e0.50 BSC.

θ

0º

3.5º

7º

Notes:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This package outline conforms to JEDEC MS-026, variant AED-HD.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body

Components.