LT8610AC datasheet(7/31 Pages) AD

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Data Sheet

LT8615

analog.com

Rev 0

7 of 31

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 3. Pin Configuration

16-LEAD (3mm × 3mm) PLASTIC QFN

DEMO BOARD: θJA = 32°C/W, ΨJT = 1.2°C/W (3)

JEDEC BOARD: θJCTOP = 51.8°C/W, θJCBOTTOM = 7.7°C/W

Table 3. Pin Descriptions

NAME

DESCRIPTION

INTVCC

Internal 3.5V Regulator Bypass Pin. The internal power drivers and control circuits are

powered from this voltage. INTVCC max. output current is 20mA. Voltage on INTVCC

varies between 2.8V and 3.5V. Decouple this pin to power ground with at least a 1μF

low ESR ceramic capacitor. Do not load the INTVCC pin with external circuitry.

No Connect.

Exposed

Pad Pin

The SW pin is the output of the internal power switches. Connect this pin to the

inductor and boost capacitor. This node should be kept small on the PCB for good

performance. The exposed pad should be soldered to the PCB for good thermal

performance.

BST

This pin is used to provide a drive voltage, higher than the input voltage, to the topside

power switch. Place a 0.1µF boost capacitor as close as possible to the IC. Do not place

a resistor in series with this pin.

5 to 8

VIN

The VIN pin supplies current to the LT8615 internal circuitry and to the internal topside

power switch. This pin must be locally bypassed. Be sure to place the positive terminal

of the input capacitor as close as possible to the VIN pins, and the negative capacitor

terminal as close as possible to the GND pins

EN/UV

The LT8615 is shut down when this pin is low and active when this pin is high. The

hysteretic threshold voltage is 1.05V going up and 1.00V going down. Tie to VIN if the

shutdown feature is not used. An external resistor divider from VIN can be used to

program a VIN threshold, below which the LT8615 shuts down.

NOTES

1. NC = NO CONNECT.

2. THE EXPOSED PADS MUST BE SOLDERED

TO THE PCB IN ORDER TO LOWER THE

THERMAL RESISTANCE.

INTVCC

BST

9 EN/UV

10 GND

11 GND

12 TR/SS

LT8615

TOP VIEW

GND

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