ADG772

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

0.40

BSC

1

4

6

9

PIN 1

IDENTIFIER

TOP VIEW

BOTTOM VIEW

SEATING

PLANE

0.20 DIA

TYP

0.60

0.55

0.50

0.20 BSC

1.60

1.30

0.55

0.40

0.30

0.35

0.30

0.25

0.05 MAX

0.02 NOM

Figure 31. 10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)

1.30 mm × 1.60 mm Body, Ultra Thin Quad

(CP-10-10)

Dimensions shown in millimeters

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1

EXCEPT FOR EXPOSED PAD DIMENSION.

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

0.75

0.55

0.35

0.25 MIN

0.45

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

PIN 1

INDICATOR

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

*1.45

1.30 SQ

1.15

12

4

10

6

7

9

3

2.75

BSC SQ

3.00

BSC SQ

2

5

8

11

COPLANARITY

0.08

EXPOSED PAD

(BOTTOM VIEW)

SEATING

PLANE

Figure 32. 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

3 mm × 3 mm Body, Very Thin Quad

(CP-12-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

–40°C to +85°C

12-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-12-1

S2P

–40°C to +85°C

10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)

CP-10-10

B

–40°C to +85°C

10-Lead Mini Lead Frame Chip Scale Package (LFCSP_UQ)

CP-10-10

B

–40°C to +85°C

Evaluation Board

©2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D06692-0-8/07(0)