OPA392DBVT datasheet(7/52 Pages) TI

7 / 52 page

6.4 Thermal Information - OPA392

THERMAL METRIC(1)

OPA392

UNIT

DBV (SOT-23)

DCK (SC70)

YBJ (DSBGA)

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

187.1

220.8

135.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

107.4

124.4

1.1

°C/W

RθJB

Junction-to-board thermal resistance

57.5

72.9

38.8

°C/W

ΨJT

Junction-to-top characterization parameter

33.5

46.1

0.4

°C/W

ΨJB

Junction-to-board characterization parameter

57.1

72.6

38.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information - OPA2392

THERMAL METRIC(1)

OPA2392

UNIT

D (SOIC)

DGK (VSSOP)

DSG (WSON)

YBJ (DSBGA)

8 PINS

9 PINS

RθJA

Junction-to-ambient thermal resistance

131.7

165

70.9

110.7

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

71.4

88.3

0.7

°C/W

RθJB

Junction-to-board thermal resistance

75.2

37.5

32.1

°C/W

ΨJT

Junction-to-top characterization

parameter

21.8

4.9

2.9

0.3

°C/W

ΨJB

Junction-to-board characterization

parameter

74.4

37.5

32.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

12.8

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

OPA392, OPA2392

SBOS926H – JANUARY 2021 – REVISED NOVEMBER 2024

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OPA392DBVT Datasheet(PDF) 7 Page - Texas Instruments

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