King Billion Electronics Co., Ltd

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HE83005

HE80000 SERIES

July 28, 2003

4

V3.4

This specification is subject to change without notice. Please contact sales person for the latest version before use.

Pin Name I/O

Description

device.

VO

O Current DAC Output.

OPIN

I Inverting input of OP Amp.

OPIP

I Non-inverting input of OP Amp.

OPO

O Output of OP Amp.

VDD

P

Positive power Input. A 0.1 µF decoupling capacitors should be placed as close to IC VDD

and GND pads as possible for best decoupling effect.

GND

P Power ground Input.

I: Input, O: Output, B: Bidirectional, P: Power.

5. Oscillators

The MCU is equipped with two clock sources with a variety of selections on the types of oscillators to

choose from. System designer can select oscillator types based on the cost target, timing accuracy

requirements etc. Crystal, Resonator or the RC oscillator can be used as fast clock source, components

should be placed as close to the pins as possible. The type of oscillator used is selected by mask option

MO_FXTAL.

FXI (Bi-direction), FXO (Output)

Mask Option

Description

MO_FXTAL

0: RC Oscillator.

1: Crystal Oscillator.

MO_FCK

0: Fast clock disable

1: Fast clock enable

SXI (Bi-direction), SXO (Output)

Two types of oscillator, crystal and RC, can be used as slow clock selectable by mask option

MO_SXTAL. If used time keeping function or other applications that required the accurate timing, crystal

oscillator is recommended. If the timing accuracy is not important, then RC type oscillator can be used to

save cost.

VDD

FXI

FXO

FXI

R

C

X'tal

10P

10P