King Billion Electronics Co., Ltd

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HE83005

HE80000 SERIES

July 28, 2003

12

V3.4

This specification is subject to change without notice. Please contact sales person for the latest version before use.

11. Pad Diagram & Location

Which version of HE83005 delivered to customer is decided by KingBillion, user shall make sure the

delivered version before PCB is manufactured. The locations of chips logo are different from each

other.

A1 Version：Die Size= 2050 µm * 2180 µm