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RT9702PB Datasheet(PDF) 12 Page - Richtek Technology Corporation

Part # RT9702PB
Description  80m廓, 500mA/1.1A High-Side Power Switches with Flag
PDF  16 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9702PB Datasheet(HTML) 12 Page - Richtek Technology Corporation

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RT9702/A
12
DS9702/A-11
June 2007
www.richtek.com
Thermal Shutdown
Thermal shutdown is employed to protect the device from
damage if the die temperature exceeds approxi- mately
130
°C. If enabled, the switch automatically restarts when
the die temperature falls 20
°C. The output and FLG
signal will continue to cycle on and off until the device is
disabled or the fault is removed.
Power Dissipation
The device s junction temperature depends on several
factors such as the load, PCB layout, ambient temperature
and package type. The output pin of RT9702/A can deliver
a current of up to 500mA, and 1.1A respectively over the
full operating junction temperature range. However, the
maximum output current must be derated at higher
ambient temperature to ensure the junction temperature
does not exceed 100
°C. With all possible conditions, the
junction temperature must be within the range specified
under operating conditions. Power dissipation can be
calculated based on the output current and the RDS(ON) of
switch as below.
PD = RDS(ON) x IOUT2
Although the devices are rated for 500mA and 1.1A of
output current, but the application may limit the amount
of output current based on the total power dissipation and
the ambient temperature. The final operating junction
temperature for any set of conditions can be estimated
by the following thermal equation:
PD (MAX) = ( TJ (MAX) - TA ) /
θJA
Where TJ (MAX) is the maximum junction temperature of
the die (100
°C) and TA is the maximum ambient
temperature. The junction to ambient thermal resistance
(
θJA)for SOT-23-5 andTSOT-23-5 package at recommended
minimum footprint is 250
°C/W (θJA is layout dependent).
Universal Serial Bus (USB) & Power Distribution
The goal of USB is to be enabled device from different
vendors to interoperate in an open architecture. USB
features include ease of use for the end user, a wide range
of workloads and applications, robustness, synergy with
the PC industry, and low-cost implement- ation. Benefits
include self-identifying peripherals, dynamically attachable
and reconfigurable peripherals, multiple connections
(support for concurrent operation of many devices), support
for as many as 127 physical devices, and compatibility
with PC Plug-and-Play architecture.
The Universal Serial Bus connects USB devices with a
USB host: each USB system has one USB host. USB
devices are classified either as hubs, which provide
additional attachment points to the USB, or as functions,
which provide capabilities to the system (for example, a
digital joystick). Hub devices are then classified as either
Bus-Power Hubs or Self-Powered Hubs.
A Bus-Powered Hub draws all of the power to any internal
functions and downstream ports from the USB connector
power pins. The hub may draw up to 500mA from the
upstream device. External ports in a Bus-Powered Hub
can supply up to 100mA per port, with a maximum of four
external ports.
Self-Powered Hub power for the internal functions and
downstream ports does not come from the USB, although
the USB interface may draw up to 100mA from its
upstream connect, to allow the interface to function when
the remainder of the hub is powered down. The hub must
be able to supply up to 500mA on all of its external
downstream ports. Please refer to Universal Serial
Specification Revision 2.0 for more details on designing
compliant USB hub and host systems.
Over-Current protection devices such as fuses and PTC
resistors (also called polyfuse or polyswitch) have slow
trip times, high on-resistance, and lack the necessary
circuitry for USB-required fault reporting.
The faster trip time of the RT9702/A power distribution
allow designers to design hubs that can operate through
faults. The RT9702/A have low on-resistance and internal
fault-reporting circuitry that help the designer to meet
voltage regulation and fault notification requirements.
until the current limit circuitry responds. Once this current
limit threshold is exceeded the device enters constant
current mode until the thermal shutdown occurs or the
fault is removed.



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