Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLV2623IDGSRG4

ACTIVE

MSOP

DGS

10

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2623IDR

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2623IDRG4

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624ID

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IDG4

ACTIVE

SOIC

D

14

50

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IDR

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IDRG4

ACTIVE

SOIC

D

14

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IPW

ACTIVE

TSSOP

PW

14

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IPWG4

ACTIVE

TSSOP

PW

14

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IPWR

ACTIVE

TSSOP

PW

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2624IPWRG4

ACTIVE

TSSOP

PW

14

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2625IDR

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2625IDRG4

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2625INE4

OBSOLETE

PDIP

N

16

TBD

Call TI

Call TI

TLV2625IPWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2625IPWRG4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

7-May-2007

Addendum-Page 2