Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module

R19DS0155EK0305 Rev.3.6

Feb 17, 2025

CFR0011-120-00

Page 21

10. Soldering

The reflow profile depends on the solder paste being used and the recommendations from the paste

manufacturer should be followed to determine the proper reflow profile.

Figure 14. Reflow condition

Table 18. Typical reflow profile (lead free): J-STD-020C

Profile feature

Lead free SMD

Average ramp up rate (Tsmax to Tp)

3 °C/s Max.

Preheat

● Temperature Min (Tsmin)

● Temperature Max (Tsmax)

● Time (Tsmax to Tsmin)

● 150 °C

● 200 °C

● 60 to 180 seconds

Time maintained above

● Temperature (TL)

● Time (tL)

● 217 °C

● 60 to 150 seconds

Peak/Classification temperature (Tp)

260 °C

Time within 5 °C of peak temperature (tp)

20 to 40 seconds

Ramp down rate

6 °C/s Max.

Time from 25 °C to peak temperature

8 minutes Max.