TAPE AND REEL (MINI)

TAPE AND REEL

PAD OR

BALL

FINISH

PART MARKING*

PACKAGE

TYPE**

MSL

RATING

TEMPERATURE

RANGE (SEE

NOTE 2)

DEVICE

FINISH CODE

LT8625SPJV#TRMPBF

LT8625SPJV#TRPBF

Au (RoHS)

HNX

e4

LQFN (Laminate Package

with QFN Footprint)

3

–40°C to 150°C

LT8625SPJV-1#TRMPBF LT8625SPJV-1#TRPBF

HPC

• Contact the factory for parts specified with wider operating temperature ranges. *Pad or

ball finish code is per IPC/JEDEC J-STD-609.

• *The temperature grade is identified by a label on the shipping container.

• Recommended LGA and BGA PCB Assembly and

Manufacturing Procedures

• LGA and BGA Package and Tray Drawings

Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.

Parts ending with PBF are RoHS and WEEE compliant. **The LT8625SP package has the same dimensions as a standard 4mm × 3mm QFN package. The

LT8625SP-1 package has the same dimensions as a standard 4mm × 4mm QFN package.

For more information on lead free part marking, go to: http://www.adi.com/leadfree/

For more information on tape and reel specifications, go to: http://www.adi.com/tapeandreel/

LT8625SP/LT8625SP-1

2

Rev. C

For more information www.analog.com

ABSOLUTE MAXIMUM RATINGS

PVIN, SVIN, EN/UVLO, PG .........................................18V

SYNC, OUTS, SET, PGFB.............................................6V

PHMODE.....................................................................4V

Operating Junction Temperature (Note 2)

LT8625SPJ ........................................ –40°C to 150°C

LT8625SPJ-1 ..................................... –40°C to 150°C

Storage Temperature Range .................. –65°C to 150°C

Peak Package Body Temperature..........................260°C

(Note 1)

ORDER INFORMATION

PIN CONFIGURATION

LT8625SP

LT8625SP-1

17

20

10

7

19

8

18

9

1

22

25

6

16

21

GND

24

23

11

5

12

4

13

3

14

2

SW

PVIN

PVIN

GND

GND

NC

15

PG

SET

VC

OUTS

PGFB

RT

TOP VIEW

LQFN PACKAGE

20-LEAD (4mm × 3mm × 0.95mm)

JEDEC BOARD θJA = 45°C/W, θJC(top) = 4.0°C/W, θJC(pad) = 12.1°C/W (NOTE 3),

DEMO BOARD: θJA = 29°C/W, ΨJT = 1.7°C/W

EXPOSED PAD (PIN 21) IS GND, SHOULD BE SOLDERED TO PCB.

EXPOSED PAD AT TOP OF PACKAGE CAN OPTIONALLY BE ATTACHED

TO HEAT SINK FOR IMPROVED THERMAL PERFORMANCE

19

24

25

GND

26

GND

27

GND

28

GND

29

30

31

32

12

20

11

21

10

22

9

23

8

7

1

6

18

13

5

14

4

15

3

16

2

PG

SET

VC

OUTS

PGFB

RT

17

SW

PVIN

PVIN

GND

GND

SW

TOP VIEW

LQFN PACKAGE

24-LEAD (4mm × 4mm × 0.95mm)

JEDEC BOARD θJA = 41°C/W, θJC(top) = 4.1°C/W, θJC(pad) = 11.4°C/W (NOTE 3)

DEMO BOARD: θJA = 29°C/W, ΨJT = 1.7°C/W

EXPOSED PAD (PINS 25 – 28) ARE GND, SHOULD BE SOLDERED TO PCB.

EXPOSED PAD AT TOP OF PACKAGE CAN OPTIONALLY BE ATTACHED

TO HEAT SINK FOR IMPROVED THERMAL PERFORMANCE