HEAT SINK AND

GROUND

HEAT SINK AND

GROUND

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1,2EN

1A

1Y

2Y

2A

VCC2

VCC1

4A

4Y

3Y

3A

3,4EN

L293, L293D

www.ti.com

SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016

5 Pin Configuration and Functions

NE Package

16-Pin PDIP

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

1,2EN

1

I

Enable driver channels 1 and 2 (active high input)

<1:4>A

2, 7, 10, 15

I

Driver inputs, noninverting

<1:4>Y

3, 6, 11, 14

O

Driver outputs

3,4EN

9

I

Enable driver channels 3 and 4 (active high input)

Device ground and heat sink pin. Connect to printed-circuit-board ground plane with multiple

GROUND

4, 5, 12, 13

—

solid vias

VCC1

16

—

5-V supply for internal logic translation

VCC2

8

—

Power VCC for drivers 4.5 V to 36 V

Copyright © 1986–2016, Texas Instruments Incorporated

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