0.33 mm, typ

1.2 mm, typ

5.0 mm, min

LMK02002

www.ti.com

SNAS418 – AUGUST 2007

Figure 3.

To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground

plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite

side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but

should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in

Figure 3 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat

pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively

dissipated.

Copyright © 2007, Texas Instruments Incorporated

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