LP3918

www.ti.com

SNVS476D – AUGUST 2007 – REVISED MAY 2013

Table 2. LDO Output Voltages Selectable via Serial Interface

LDO

mA

1.5

1.8

1.85

2.5

2.6

2.7

2.75

2.8

2.85

2.9

2.95

3.0

3.05

3.1

3.2

3.3

1

CORE

300

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

2

DIGI

300

+

+

+

+

+

+

+

+

+

+

+

+

+

3

ANA

80

+

+

+

+

+

+

+

+

4

TCXO

80

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

5

RX

150

+

+

+

+

+

+

+

+

6

TX

150

+

+

+

+

+

+

+

+

7

GP

150

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

+

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

CHG-IN,

−0.3 to +6.5V

VBATT =VIN1/2, BATT,HF_PWR

−0.3 to +6V

All other Inputs

−0.3 to VBATT +0.3V, max 6.0V

Junction Temperature (TJ-MAX)

150°C

Storage Temperature

−40°C to +150°C

Max Continuous Power Dissipation(4)

(PD-MAX)

(5)

Internally Limited

ESD (6)

Batt, VIN1, VIN2, HF_PWR, CHG_IN, PWR_ON

8kV HBM

All other pins

2kV HBM

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Like the

Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. In

applications where high power dissipation and/or poor thermal dissipation exists, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA_MAX) is dependent on the maximum power dissipation of the device in the application

(PD_MAX), and the junction to ambient thermal resistance of the device/package in the application (θJA), as given by the following

equation:TA_MAX = TJ_MAX-OP – (θJA X PDMAX )

(5)

Internal Thermal Shutdown circuitry protects the device from permanent damage.

(6)

The human-body model is 100pF discharged through 1.5k

Ω. The machine model is a 200pF capacitor discharged directly into each pin,

MIL-STD-883 3015.7.

Operating Ratings

(1) (2)

CHG_IN

4.5 to 6.0V

VBATT =VIN1/2, BATT

3.0 to 5.5V

HF_PWR, PWR_ON

0V to 5.5V

ACOK_N, SDA, SCL, RX_EN, TX_EN, TCXO_EN, PS_HOLD, RESET_N

0V to (VLDO2 + 0.3V)

All other pins

0V to (VBATT + 0.3V)

Junction Temperature (TJ)

−40°C to +125°C

Ambient Temperature (TA)

-40 to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

Copyright © 2007–2013, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LP3918