4

LP3982

SNVS185F – FEBRUARY 2002 – REVISED APRIL 2017

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Copyright © 2002–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace-specified devices are required, contact Texas Instruments Sales Office/Distributors for availability and

specifications.

(4)

In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the

maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given

by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA).The value of the RθJA for the WSON package is specifically dependent on the PCB trace

area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON

package, refer to TI Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN, VOUT, VSHDN, VSET, VCC, VFAULT

−0.3

6.5

V

Fault sink current

20

mA

Power dissipation

See(4)

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

160

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Machine model

±200

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

6.3 Recommended Operating Conditions

(1) (2)

MIN

NOM

MAX

UNIT

Operating temperature

–40

85

°C

Supply voltage

2.5

6

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The PCB for the WSON/NGN package RθJA includes thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

(3)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

6.4 Thermal Information

THERMAL METRIC(1)

LP3982

UNIT

DGK (VSSOP)

NGM (WSON)(2)

8 PINS

8 PINS

RθJA

(3)

Junction-to-ambient thermal resistance, High-K

175.2

52.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.0

66.2

°C/W

RθJB

Junction-to-board thermal resistance

95.6

16.7

°C/W

ψJT

Junction-to-top characterization parameter

9.7

1.9

°C/W

ψJB

Junction-to-board characterization parameter

94.2

16.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

11.1

°C/W