TPL5000

SNAS628B – JULY 2013 – REVISED DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

–0.3

6.0

V

Input Voltage(2)

–0.3

VDD + 0.3

V

Voltage between any two pins

VDD + 0.3

V

Input Current on any pin

–5

5

mA

Operating Temperature, TA

–40

105

Junction Temperature, TJ

(3)

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

When the input voltage (VIN) at any pin exceeds the power supply (VDD), the current on that pin must not exceed 5 mA and must not

exceed 6.0 V.

(3)

The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Ratings

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

1.8

5.0

V

Temperature Range

-40

105

°C

7.4 Thermal Information

TPL5000

THERMAL METRIC(1)

VSSOP

UNIT

10 PINS

RθJA

Junction-to-ambient thermal resistance

196.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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