15

20

25

30

35

40

0.1

1

10

100

Copper Heatsink Area − cm2

No Air Flow

150 LFM

250 LFM

1 oz. Copper

Power Plane

1 oz. Copper

Ground Plane

2 oz. Copper Solder Pad

with 25 Thermal Vias

Thermal Vias, 0.3 mm

Diameter, 1,5 mm Pitch

TPS72501

TPS72515, TPS72516

TPS72518, TPS72525

www.ti.com

SLVS341E – MAY 2002 – REVISED JUNE 2010

Figure 21. DDPAK Thermal Resistance vs Copper Heatsink Area

Figure 22. DDPAK Thermal Resistance

From the data in Figure 23 and rearranging Equation 6, the maximum power dissipation for a different ground

plane area and a specific ambient temperature can be computed.

Copyright © 2002–2010, Texas Instruments Incorporated

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