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LNK562P/G/D Datasheet(PDF) 7 Page - Power Integrations, Inc. |
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LNK562P/G/D Datasheet(HTML) 7 Page - Power Integrations, Inc. |
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7 / 20 page ![]() LNK562-564 Rev. L 12/21 7 www.power.com Thermal Considerations The copper area underneath the LinkSwitch-LP acts not only as a single point ground, but also as a heatsink. As it is connected to the quiet source node, this area should be maximized for good heat sinking of LinkSwitch-LP. The same applies to the cathode of the output diode. Y-Capacitor The placement of the Y-type cap should be directly from the primary input filter capacitor positive terminal to the common/return terminal of the transformer secondary. Such a placement will route high magnitude common- mode surge currents away from the LinkSwitch-LP device. Note: If an input pi (C, L, C) EMI filter is used, then the inductor in the filter should be placed between the negative terminals on the input filter capacitors. Output Diode For best performance, the area of the loop connecting the secondary winding, the output diode and the output filter capacitor should be minimized. In addition, sufficient copper area should be provided at the anode and cathode terminals of the diode for heat sinking. A larger area is preferred at the quiet cathode terminal. A large anode area can increase high-frequency radiated EMI. Quick Design Checklist As with any power supply design, all LinkSwitch-LP designs should be verified on the bench to make sure that component specifications are not exceeded under worst-case conditions. The following minimum set of tests is strongly recommended: + HV DC INPUT - + Input Filter Capacitor - DC OUT PI-4582-061715 Maximize hatched copper areas ( ) for optimum heat sinking TOP VIEW Transformer D FB BP S S S S CBP Output Filter Capacitor Figure 7. Recommended Circuit Board Layout for LinkSwitch-LP using D Package (Assumes a HVDC Input Stage). |
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