OPA548 datasheet(5/36 Pages) TI

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50kW

100V

10kHz

+50V

E/DCom

E/D

-50V

OUT

OPA454

SBOS391 – DECEMBER 2007

ELECTRICAL CHARACTERISTICS: VS = ±50V (continued)

Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.

At TP = +25°C, RL = 4.8kΩ to mid-supply, VCM = VOUT = mid-supply, unless otherwise noted.

OPA454

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNIT

E/D (ENABLE/DISABLE) PIN

E/D Pin, Referenced to E/D Com Pin(14)(15)

High (output enabled)

VSD

Pin Open or Forced High

E/D Com + 2.5

E/D Com + 5

E/D Com +

Low (output disabled)

VSD

Pin Forced Low

E/D Com

0.65

Output Disable Time

µs

Output Enable Time

µs

E/D COM PIN

Voltage Range

(V–)

(V+) – 5

POWER SUPPLY

Specified Range

±50

Operating Voltage Range

±5

±50

Quiescent Current

IO = 0

3.2

Quiescent Current in Shutdown Mode

IO = 0, VE/D = 0.65V

150

210

µA

TEMPERATURE RANGE

Specified Range

–40

+85

°C

Operating Range

–55

+125

°C

Thermal Resistance, Junction-to-Case(16)

SO-8 PowerPAD(17)

°C/W

HSOP-20

°C/W

Thermal Resistance, Junction-to-Ambient

SO-8 PowerPAD(17)

24/52

°C/W

HSOP-20(18)

°C/W

(14) See typical characteristic curve, IENABLE vs VENABLE (Figure 46).

(15) High enables the outputs.

(16) TP is the temperature of the leadframe die pad (exposed thermal pad) of the PowerPAD package.

(17) Lower value is for land area of 1-inch

× 1-inch, 2-oz copper. Upper value is for exposed-pad sized area of 1-oz copper.

(18) Value given is for DW-20 package, similar to the DWD package, but without an exposed pad. Actual

JA may approach θJC by selection

of external heatsink and airflow.

Figure 1. Feedthrough Capacitance Circuit

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