OPA548 datasheet(22/36 Pages) TI

22 / 36 page

www.ti.com

PowerPAD THERMALLY-ENHANCED

BOTTOM-SIDE PowerPAD PACKAGE

TOP-SIDE PowerPAD PACKAGE

MoldCompound(Plastic)

LeadframeDiePad

ExposedatBaseofthePackage

(CopperAlloy)

Leadframe(CopperAlloy)

IC(Silicon)

DieAttach(Epoxy)

a)SO-8PowerPADcross-sectionview.

b)HSOP-20PowerPADcross-sectionview.

Board

ExternalHeatspreader

PowerTransistor

Chip

DiePad

Die

Attach

Thermal

Paste

OPA454

SBOS391 – DECEMBER 2007

PACKAGES

The OPA454 SO-8 PowerPAD is a standard-size

The

OPA454

comes

SO-8

and

HSOP-20

SO-8

package

constructed

using

downset

PowerPAD versions that provide an extremely low

leadframe upon which the die is mounted, as

thermal resistance (

JC) path between the die and the

Figure 71a shows. This arrangement results in the

exterior of the package. These packages feature an

lead frame being exposed as a thermal pad on the

exposed thermal pad. This thermal pad has direct

underside of the package. The thermal pad on the

thermal contact with the die; thus, excellent thermal

bottom of the IC can then be soldered directly to the

performance is achieved by providing a good thermal

PCB, using the PCB as a heatsink. In addition,

path away from the thermal pad.

plated-through holes (vias) provide a low thermal

resistance heat flow path to the back side of the PCB.

This

architecture

enhances

the

OPA454

power

dissipation capability significantly, eliminates the use

The OPA454 DWD, HSOP-20, PowerPAD package

of bulky heatsinks and slugs traditionally used in

has the exposed pad on the top side of the package,

thermal packages, and allows the OPA454 to be

as Figure 71b shows. The top-side thermal pad can

easily

mounted

using

standard

PCB

assembly

be used with commercially available heat-sinks and

techniques. NOTE: Because the SO-8 PowerPAD is

moving air to dissipate heat. The use of an external

pin-compatible with standard SO-8 packages, the

top-side heat-sink increases the effective surface

OPA454 is a drop-in replacement for operational

area of the package face, which increases convection

amplifiers

existing

sockets.

Soldering

the

and radiation off the top surface of the package.

bottom-side

PowerPAD

the

PCB

always

Top-side

heatsinking

also

avoids

unnecessary

required, even with applications that have low power

heating of the printed circuit board (PCB), and

dissipation. Soldering the device to the PCB provides

permits installation of other PCB components onto

the necessary thermal and mechanical connection

the side opposite of the OPA454.

between the leadframe die pad and the PCB.

Figure 71. Cross-Section Views of a PowerPAD Package

Submit Documentation Feedback

Product Folder Link(s): OPA454

OPA548 Datasheet(PDF) 22 Page - Texas Instruments

OPA548 Datasheet(HTML) 22 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

Datasheet Download

Link URL