Rev. D 09/19

7

SIC1182K

www.power.com

Thermal Resistance

Thermal Resistance: eSOP-R16B Package:

(θ

JA) .................................................. 67 °C/W

1

(θ

JC) .................................................. 34 °C/W

2

Notes:

1. 2 oz. (610 g/m2) copper clad.

2. The case temperature is measured at the plastic surface at the top

of the package.

Parameter

Symbol

Conditions

Min

Max

Units

Absolute Maximum Ratings1

Primary-Side Supply Voltage2

V

VCC

VCC to GND

-0.5

6.5

V

Secondary-Side Total Supply Voltage

V

TOT

VISO to COM

-0.5

30

V

Secondary-Side Positive Supply Voltage

V

VISO

VISO to VEE

-0.5

20

V

Secondary-Side Negative Supply Voltage

V

VEE

VEE to COM

-0.5

15

V

Logic Input Voltage (command signal)

V

IN

IN to GND

-0.5

V

VCC + 0.5

V

Logic Output Voltage (fault signal)

V

SO

SO to GND

-0.5

V

VCC + 0.5

V

Logic Output Current (fault signal)

I

SO

Positive Current Flowing into the Pin

10

mA

Switching Frequency

f

S

150

kHz

Storage Temperature

T

S

-65

150

°C

Operating Junction Temperature

T

J

-40

1503

°C

Operating Ambient Temperature

T

A

-40

125

°C

Operating Case Temperature

T

C

-40

125

°C

Input Power Dissipation4

P

P

V

VCC = 5 V, VTOT = 28 V,

T

A = 25 °C

f

S = 150 kHz

188

mW

Output Power Dissipation4

P

S

1602

Total IC Power Dissipation

P

DIS

1790

mW

NOTES:

1. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.

2. Defined as peak voltage measured directly on VCC pin.

3. Transmission of command signals could be affected by PCB layout parasitic inductances at junction temperatures higher than recommended.

4. Input Power Dissipation refers to Equation (3). Output Power Dissipation is secondary-side IC power dissipation without capacitive load

(P

SNL, Equation (4)) and dissipated power under load (POL, Equation (5)). Total IC power dissipation is sum of PP and PS.