Rev. D 09/19

13

SIC1182K

www.power.com

PI-6995-051716

POD-eSOP-R16B Rev B

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold

flash, tie bar burrs, gate burrs, and inter-lead flash, but including any mismatch between the top

and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side.

3. Dimensions noted are inclusive of plating thickness.

4. Does not include inter-lead flash or protrusions.

5. Controlling dimensions in inches [mm].

6. Datums A and B to be determined in Datum H.

7. Exposed metal at the plastic package body outline/surface between leads 6 and 7, connected

internally to wide lead 3/4/5/6.

0.356 [9.04]Ref.

0.306 [7.77] Ref.

0.080 [2.03] Ref.

0.050 [1.27]

0.464 [11.79]

0.010 [0.25]

0.400 [10.16]

0.350 [8.89]

Pin #1 I.D.

(Laser Marked)

16

9

9 10 11 12 13 14 15 16

1

8

8

7

6

5

4 3

1

2

2

0.045 [1.14] Ref.

0.158 [4.01]

0.152 [3.86]

0.040 [1.02]

0.028 [0.71]

0.032 [0.81]

0.029 [0.74]

0.012 [0.30]

0.004 [0.10]

0.049 [1.23]

0.046 [1.16]

0.092 [2.34]

0.086 [2.18]

Detail A

0.105 [2.67]

0.093 [2.36]

Gauge Plane

Seating Plane

4

3

SIDE VIEW

TOP VIEW

BOTTOM VIEW

DETAIL A

END VIEW

0.059 [1.50]

Ref. Typ.

0.010 [0.25] Ref.

0.019 [0.48]

Ref.

0.022 [0.56] Ref.

0.020 [0.51]

Ref.

0.028 [0.71]

Ref.

0.057 [1.45] Ref.

0° - 8°

0.059 [1.50]

Ref. Typ.

0.010 [0.24]

Ref.

13X

0.023 [0.58]

0.018 [0.46]

0.010 [0.25] M C A B

4

3

0.004 [0.10]

2X

12X

C B

0.004 [0.10]

12 Leads

Seating Plane to

Molded Bumps

Standoff

Seating

Plane

C

0.004 [0.10]

2X

C A

0.006 [0.15]

8 Lead Tips

C

0.006 [0.15]

4 Lead Tips

C

B

C

H

A

0.016 [0.41]

0.011 [0.28]

C

7

3

.028 [0.71]

.070 [1.78]

.460 [11.68]

.162 [4.11]

.165 [4.19]

.300 [7.62]

INCH [mm]

.350 [8.89]

.050 [1.27]

eSOP-R16B

Reference

Solder Pad

Dimensions