4

LM3241

SNOSB38C – JANUARY 2009 – REVISED NOVEMBER 2017

www.ti.com

Product Folder Links: LM3241

Submit Documentation Feedback

Copyright © 2009–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

All pins are limited to the 6-V maximum stated for the VIN supply.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 125°C (typical).

6 Specifications

6.1 Absolute Maximum Ratings

See

(1) and (2).

MIN

MAX

UNIT

Pin voltage

VIN to GND

–0.2

6

V

EN, FB, VCON, SW

(GND

− 0.2)

(VIN + 0.2)(3)

Continuous power dissipation(4)

Internally limited

Junction temperature, TJ-MAX

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. (MIL-STD-883 3015.7).

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(3)

1250

(1)

All voltages are with respect to the potential at the GND pins.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.3 Recommended Operating Conditions

See

(1).

MIN

NOM

MAX

UNIT

Input voltage

2.7

5.5

V

Recommended load current

0

750

mA

TJ

Junction temperature

–40

125

°C

TA

Ambient temperature(2)

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM3241

UNIT

YZR (DSBGA)

6 PINS

RθJA

Junction-to-ambient thermal resistance

117

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1

°C/W

RθJB

Junction-to-board thermal resistance

32.5

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

32.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W