LMV112

VCC

GND

1 nF

EN1

IN1

IN2

EN2

1

1

2

3

4

5

6

7

8

OUT1

OUT2

VCTCXO

Rload

Rload

Cload

Cload

LOAD1

LOAD2

Enable

2

Enable

LMV112

SNAS297B – MAY 2005 – REVISED MAY 2013

www.ti.com

TYPICAL APPLICATION

Figure 1.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Supply Voltages (V+– V−)

5.5V

ESD Tolerance (3)

Human Body

2000V

Machine Model

200V

Storage Temperature Range

−65°C to +150°C

Junction Temperature (4)

+150°C

Soldering Information

Infrared or Convection (35 sec.)

235°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the

Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model: 1.5 k

Ω in series with 100 pF. Machine Model: 0Ω in series with 200 pF.

(4)

The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA) / θJA. All numbers apply for packages soldered directly onto a PC board.

OPERATING RATINGS

(1)

Supply Voltage (V+ – V−)

2.4V to 5.0V

Temperature Range (2) (3)

−40°C to +85°C

Package Thermal Resistance (2) (3)

WSON-8 (

θJA)

217°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the

Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA) / θJA. All numbers apply for packages soldered directly onto a PC board.

(3)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA .

2

Submit Documentation Feedback

Copyright © 2005–2013, Texas Instruments Incorporated

Product Folder Links: LMV112