OPA358

SB0S296C − MARCH 2004 − REVISED FEBRUARY 2005

www.ti.com

2

PACKAGE/ORDERING INFORMATION(1)

PRODUCT

PACKAGE

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

OPA358

SC70-6

DCK

−40

°C to +85°C

AUS

OPA358AIDCKT

Tape and Reel, 250

OPA358

SC70-6

DCK

−40

°C to +85°C

AUS

OPA358AIDCKR

Tape and Reel, 3000

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the

TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage, V+ to V−

+3.6V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals, Voltage(2)

(V−) −0.5V to (V+) + 0.5V

. . . .

Signal Input Terminals, Current(2)

±10mA

. . . . . . . . . . . . . . . . . . . .

Output Short-Circuit(3)

Continuous

. . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−40

°C to +85°C

. . . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−65

°C to +150°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+160

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s)

+300

°C

. . . . . . . . . . . . . . . . . . . .

ESD Rating:

Human Body Model (HBM)

4000V

. . . . . . . . . . . . . . . . . . . . . . .

Charged Device Model (CDM)

1500V

. . . . . . . . . . . . . . . . . . . .

Machine Model (MM)

400V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

(2) Input terminals are diode-clamped to the power-supply rails.

Input signals that can swing more than 0.5V beyond the supply

rails should be current-limited to 10mA or less.

(3) Short-circuit to ground, one amplifier per package.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PIN CONFIGURATIONS

(1) Pin 1 is determined by orienting the package marking as indicated in the diagram.

1

2

3

6

5

4

V+

Enable

Out

+In

GND

−In

OPA358

SC70−6(1)