DAC1282, DAC1282A

SBAS490B – DECEMBER 2011 – REVISED MAY 2015

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7 Specifications

7.1

Absolute Maximum Ratings

(1)

Over operating free-air temperature range, unless otherwise noted.

MIN

MAX

UNIT

AVDD to AVSS

–0.3

+5.5

V

AVSS to DGND

–2.8

+0.3

V

DVDD to DGND

–0.3

+3.6

V

Input current continuous

–10

+10

mA

Analog input/output voltage

AVSS – 0.3

AVDD + 0.3

V

Switch current

–60

+60

mA

Digital input voltage to DGND

–0.3

DVDD + 0.3

V

Operating temperature range

–50

+125

°C

Storage temperature, Tstg

–60

+150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

PW (TSSOP)

THERMAL METRIC(1)

UNIT

24 PINS

RθJA

Junction-to-ambient thermal resistance

78.3

RθJC(top)

Junction-to-case (top) thermal resistance

12.1

RθJB

Junction-to-board thermal resistance

33.8

°C/W

ψJT

Junction-to-top characterization parameter

0.3

ψJB

Junction-to-board characterization parameter

33.5

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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