VFPPACKAGE

(TOPVIEW)

31 30 29 28 27

9 10

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

2OUT

NC

VCCL+

NC

2IN−

NC

2IN+

NC

1OUT

NC

VCCL−

NC

1IN−

NC

1IN+

NC

32

26

11 12 13 14 15 16

25

NC − Nointernalconnection

PowerPAD

?

VCCL+

DGND

−

+

VCCH+

2OUT

19

18

17

16

15

12

2IN−

2IN+

1OUT

1IN−

1IN+

VCCL−

VCCH−

SHDN1

8

5

6

3

2

4

−

+

SHDN2

9

THS6032

www.ti.com....................................................................................................................................................... SLOS233F – APRIL 1999 – REVISED AUGUST 2009

FUNCTIONAL BLOCK DIAGRAM (SOIC PACKAGE)

A.

Terminals 1, 10, 11, and 20 are internally connected to the thermal pad.

Copyright © 1999–2009, Texas Instruments Incorporated

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Product Folder Link(s): THS6032