6.4 Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

MIN

NOM

MAX

UNIT

ENVIRONMENTAL

TARRAY

Array Temperature – long-term operational(11) (12) (13) (14)

0

40 to 70(13)

°C

Array Temperature - short-term operational, 25 hr max(12) (15)

–20

–10

Array Temperature - short-term operational, 500 hr max(12) (15)

–10

0

Array Temperature – short-term operational, 500 hr max(12) (15)

70

75

|TDELTA |

Absolute Temperature difference between any point on the window

edge and the ceramic test point TP1 (16)

15

°C

TWINDOW

Window temperature – operational(11) (17)

90

°C

TDP-AVG

Average dew point temperature (non-condensing)(18)

24

°C

TDP-ELR

Elevated dew point temperature range (non-condensing)(19)

28

36

°C

CTELR

Cumulative time in elevated dew point temperature range

6 Months

ILLUMINATION

ILLUV

Illumination power at wavelengths < 410 nm(11)

10 mW/cm2

ILLVIS

Illumination power at wavelengths ≥ 410 nm and ≤ 800 nm(21)

26.1

W/cm2

ILLIR

Illumination power at wavelengths > 800 nm

10 mW/cm2

ILLBLU

Illumination power at wavelengths ≥ 410 nm and ≤ 475 nm(21)

8.3

W/cm2

ILLBLU1

Illumination power at wavelengths ≥ 410 nm and ≤ 445 nm(21)

1.5

W/cm2

ILLθ

Illumination marginal ray angle(20)

55

deg

(1)

Section 6.4 are applicable after the DMD is installed in the final product.

(2)

The functional performance of the device specified in this datasheet is achieved when operating the device within the limits defined by

the Section 6.4. No level of performance is implied when operating the device above or below the Section 6.4 limits.

(3)

The following power supplies are all required to operate the DMD: VSS, VDD, VDDI, VOFFSET, VBIAS, and VRESET.

(4)

All voltage values are with respect to the ground pins (VSS).

(5)

VOFFSET supply transients must fall within specified maximum voltages.

(6)

To prevent excess current, the supply voltage delta |VDDI – VDD| must be less than specified limit.

(7)

To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit.

(8)

To prevent excess current, the supply voltage delta |VBIAS – VRESET| must be less than specified limit.

(9)

LS_CLK must run as specified to ensure internal DMD timing for reset waveform commands.

(10) Refer to the SubLVDS timing requirements in Section 6.7.

(11) Simultaneous exposure of the DMD to the maximum Section 6.4 for temperature and UV illumination will reduce device lifetime.

(12) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point 1

(TP1) shown in Figure 7-1 and the Package Thermal Resistance using Section 7.6.

(13) Per Figure 6-1, the maximum operational array temperature should be derated based on the micromirror landed duty cycle that the

DMD experiences in the end application. Refer to Section 7.8 for a definition of micromirror landed duty cycle.

(14) Long-term is defined as the usable life of the device.

(15) Short-term is the total cumulative time over the useful life of the device.

(16) Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge shown in Figure

7-1. The window test points TP2 and TP3 shown in Figure 7-1 are intended to result in the worst case delta temperature. If a particular

application causes another point on the window edge to result in a larger delta temperature, that point should be used.

(17) Window temperature is the highest temperature on the window edge shown in Figure 7-1. The locations of thermal test points TP2 and

TP3 in Figure 7-1 are intended to measure the highest window edge temperature. If a particular application causes another point on

the window edge to result in a larger delta temperature, that point should be used.

(18) The average over time (including storage and operating) that the device is not in the elevated dew point temperature range.

(19) Exposure to dew point temperatures in the elevated range during storage and operation should be limited to less than a total

cumulative time of CTELR.

(20) The maximum marginal ray angle of the incoming illumination light at any point in the micromirror array, including Pond of Micromirrors

(POM), should not exceed 55 degrees from the normal to the device array plane. The device window aperture has not necessarily

been designed to allow incoming light at higher maximum angles to pass to the micromirrors, and the device performance has not

been tested nor qualified at angles exceeding this. Illumination light exceeding this angle outside the micromirror array (including POM)

will contribute to thermal limitations described in this document, and may negatively affect lifetime.

(21) The maximum allowable optical power incident on the DMD is limited by the maximum optical power density for each wavelength

range specified and the micromirror array temperature (TARRAY).

DLP3010LC

DLPS179C – APRIL 2020 – REVISED JULY 2023

www.ti.com

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