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LSF0108 Datasheet(PDF) 196 Page - Nexperia B.V. All rights reserved

Part # LSF0108
Description  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 Datasheet(HTML) 196 Page - Nexperia B.V. All rights reserved

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background image
Nexperia selection guide 2020
196
2-pin SMD packages
Minimized outline drawings and reflow soldering footprint
Dimensions in mm
LLDS; MiniMelf (SOD80C)
06-03-16
Dimensions in mm
1.60
1.45
0.3
3.7
3.3
0.3
2.30
4.30
4.55
1.60
1.70
2.25
0.90
(2x)
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
LLDS; MiniMelf (SOD80C)
CFP3 (SOD123W)
CFP3 (SOD123W)
2.9
2.8
4.4
1.6
2.1
1.2
(2´)
1.1
(2´)
solder lands
solder resist
occupied area
solder paste
1.1
(2´)
1.2
(2´)
sod123w_fr
Dimensions in mm
SOD123
NXP Semiconductors
SOD123
Plastic surface-mounted package; 2 leads
SOD123
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved
Package information
28 September 2016
2 / 6
2. Package outline
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOD123
sod123_po
16-05-26
16-08-31
Unit
mm
max
nom
min
1.3 0.10
0.25 2.80 1.7 3.75
A
Dimensions (mm are the original dimensions)
Note
1. The marking band indicates the cathode.
Plastic surface-mounted package; 2 leads
SOD123
A1
bp
0.70
c
D
E
HE
Lp
Q
v
0.2
0.15
1.0 0.00
0.10 2.55 1.5 3.45
0.55
0.45
0.6
0.7
0
2 mm
scale
(1)
A1
D
c
HE
bp
(2x)
2
1
E
A
Q
v
A
Lp
(2x)
A
Fig. 1. Package outline SOD123
SOD123
NXP Semiconductors
SOD123
Plastic surface-mounted package; 2 leads
SOD123
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved
Package information
28 September 2016
3 / 6
3. Soldering
SOD123
sod123_fr
occupied area
solder paste
solder resist
Cu pad
Dimensions in mm
16-05-10
16-08-31
0.81
0.91
2.36
1.11
0.81
4.18
0.91
1.11
3.27
4.58
3.1
1.42
1.12 1.22
2.1 1.62
Fig. 2. Reflow soldering footprint for SOD123
NXP Semiconductors
SOD123
Plastic surface-mounted package; 2 leads
SOD123
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved
Package information
28 September 2016
3 / 6
3. Soldering
SOD123
sod123_fr
occupied area
solder paste
solder resist
Cu pad
Dimensions in mm
16-05-10
16-08-31
0.81
0.91
2.36
1.11
0.81
4.18
0.91
1.11
3.27
4.58
3.1
1.42
1.12 1.22
2.1 1.62
Fig. 2. Reflow soldering footprint for SOD123
NXP Semiconductors
SOD123
Plastic surface-mounted package; 2 leads
SOD123
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved
Package information
28 September 2016
3 / 6
3. Soldering
SOD123
sod123_fr
occupied area
solder paste
solder resist
Cu pad
Dimensions in mm
16-05-10
16-08-31
0.81
0.91
2.36
1.11
0.81
4.18
0.91
1.11
3.27
4.58
3.1
1.42
1.12 1.22
2.1 1.62
Fig. 2. Reflow soldering footprint for SOD123
SOD123F
SOD123F
1.6
1.6
2.9
4
4.4
1.1 1.2
2.1
1.1
(2´)
solder lands
solder resist
occupied area
solder paste
1.6
1.6
2.9
4
4.4
1.1 1.2
2.1
1.1
(2´)
solder lands
solder resist
occupied area
solder paste
Images are for reference only, for detailed drawings please visit nexperia.com/packages



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