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LSF0108 Datasheet(PDF) 200 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 200 Page - Nexperia B.V. All rights reserved |
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200 / 234 page ![]() Nexperia selection guide 2020 200 3-pin SMD packages CFP15B (SOT1289B) CFP15B (SOT1289B) b a d e f c b a d e f c 1 2 3 4 1 2 3 4 NAME CHECK SUPERS. / ECP# APPR. MM UNIT PROJ. SCALE REV SIZE SHEET OF nexperia © DAT REFLOW SOLDERING Occupied Area Solder Resist Solder Land Solder Paste Recommended stencil thickness: 0.1mm b a d e f c b a d e f c 1 2 3 4 1 2 3 4 NAME CHECK SUPERS. / ECP# APPR. MM UNIT PROJ. SCALE REV SIZE SHEET OF nexperia © DAT REFLOW SOLDERING Occupied Area Solder Resist Solder Land Solder Paste Recommended stencil thickness: 0.1mm Images are for reference only, for detailed drawings please visit nexperia.com/packages CFP15 (SOT1289) CFP15 (SOT1289) Package outline © 2010 NXP B.V. All rights reserved. Reproduction in whole or in part is prohibited without prior consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of it’s use. Publication thereof does not convey or imply any license under patent- or other industrial or intellectual property rights. Printed in the Netherlands www.nxp.com References Outline version European projection Issue date IEC JEDEC JEITA SOT1289 sot1289_po 13-07-12 13-08-27 Unit mm max nom min 5.9 4.4 4.71 1.09 2.05 A Dimensions (mm are the original dimensions) Note 1. Dimension A is excluding plating thickness. CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm SOT1289 C D 6.6 D1 E e b b1 4.01 b2 b3 L 3.31 L1 L2 1.2 0.78 0.2 5.8 4.3 2.13 4.61 6.5 0.99 1.95 3.91 3.21 0.25 1.1 5.7 4.2 4.51 6.4 1.19 2.15 4.11 3.41 1.3 0 2.5 5 mm scale 3 2 1 1 2 3 E D1 D C b3 L1 b1 b2 (2x) b3 (2x) L2 (2x) L b A e Nexperia SOT1289 plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT1289 sot1289_po 14-07-23 14-09-01 Unit mm max nom min 5.9 4.4 4.8 1.1 2.05 A Dimensions (mm are the original dimensions) CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm SOT1289 C D 0.82 D1 E e b b1 4.0 b2 b3 L 3.3 L1 L2 1.2 0.78 0.20 0.24 0.16 5.8 4.3 2.13 4.6 6.5 6.4 6.6 0.9 1.95 3.8 3.1 0.25 1.1 5.7 4.2 4.4 0.74 1.3 2.15 4.2 3.5 0.35 0.45 1.3 0 2.5 5 mm scale 3 2 1 1 2 3 E D1 D C b3 L1 b1 b2 (2x) b3 (2x) L2 (2x) L b A e Fig. 1. Package outline CFP15 (SOT1289) SOT1289 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 2 / 5 Nexperia SOT1289 plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body 3. Soldering Footprint information for reflow soldering of CFP15 package SOT1289 sot1289_fr Dimensions in mm occupied area solder paste solder resist solder lands Issue date 13-08-28 14-03-12 2.13 1.4 (2×) 1.8 (2×) 1.6 (2×) 4.6 3.73 1.7 (4×) 0.2 2.4 3.8 4 0.11 0.2 0.2 0.4 1.02 0.6 0.05 7.5 0.6 1.9 1.9 5.16 4.96 1.34 1.44 1.64 Fig. 2. Reflow soldering footprint for CFP15 (SOT1289) SOT1289 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 3 / 5 Dimensions in mm SOT89 (SC-62) SOT89 (SC-62) solder lands solder resist occupied area solder paste sot089_fr 1.2 1.9 2 2.25 4.75 1 (3´) 0.7 (3´) 0.6 (3´) 1.1 (2´) 1.2 0.85 0.2 0.5 1.7 4.85 3.95 4.6 1.5 1.5 Dimensions in mm solder lands solder resist occupied area solder paste sot089_fr 1.2 1.9 2 2.25 4.75 1 (3´) 0.7 (3´) 0.6 (3´) 1.1 (2´) 1.2 0.85 0.2 0.5 1.7 4.85 3.95 4.6 1.5 1.5 Dimensions in mm Minimized outline drawings and reflow soldering footprint TO-236AB (SOT23) TO-236AB (SOT23) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3´) 0.6 (3´) 0.6 (3´) 0.7 (3´) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm solder lands solder resist occupied area solder paste sot023_fr 0.5 (3´) 0.6 (3´) 0.6 (3´) 0.7 (3´) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm |
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