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LSF0108 Datasheet(PDF) 202 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 202 Page - Nexperia B.V. All rights reserved |
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202 / 234 page ![]() Nexperia selection guide 2020 202 4-pin SMD packages Images are for reference only, for detailed drawings please visit nexperia.com/packages Minimized outline drawings and reflow soldering footprint SC-73 (SOT223) SC-73 (SOT223) 1.2 (4´) 1.2 (3´) 1.3 (4´) 1.3 (3´) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 23 1 solder lands solder resist occupied area solder paste Dimensions in mm 1.2 (4´) 1.2 (3´) 1.3 (4´) 1.3 (3´) 6.15 7 3.85 3.6 3.5 0.3 3.9 7.65 2.3 2.3 6.1 4 23 1 solder lands solder resist occupied area solder paste Dimensions in mm 5-pin SMD packages X2SON5 (SOT1226) X2SON5 (SOT1226) LFPAK88 (SOT1235) LFPAK88 (SOT1235) NXP Semiconductors SOT1235 Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads SOT1235 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved Package information 13 June 2016 2 / 4 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT1235 sot1235_po 16-05-25 16-06-02 Unit mm max nom min 1.85 0.15 8.4 0.30 0.55 6.45 A Dimensions (mm are the original dimensions) LFPAK88: Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads SOT1235 A1 b 1.275 b2 c c2 D θ D1 E1 e H L L1 6.9 2 4.9 0.9 0.85 8.2 0.40 7.8 L2 1.3 w 0.25 0.10 y 6.7 8.1 7.9 1.65 0.00 7.6 1.125 0.25 A3 1.775 A2 1.625 0.23 0.49 6.15 0° 4.7 E 0.4 0.8 8° 0 8 mm 4 scale A θ E detail X C A3 A1 A L C y X mounting base c2 A2 c L2 L1 b (4x) D H e 1/2 e w A 1 2 3 4 b2 E1 D1 Fig. 1. Package outline LFPAK (SOT1235) b a d e f c b a d e f c 1 2 3 4 1 2 3 4 NAME CHECK SUPERS. / ECP# APPR. MM UNIT PROJ. SCALE REV SIZE SHEET OF nexperia © DAT REFLOW SOLDERING Occupied Area Solder Resist Solder Land Solder Paste Recommended stencil thickness: 0.125mm LFPAK56; Power-SO8 (SOT669) LFPAK56; Power-SO8 (SOT669) 0.6 (3´) 0.7 (4´) 0.25 (2´) 0.25 (2´) 0.6 (4´) 4.2 4.7 0.25 (2´) 1.27 1.1 2 3.81 0.9 (3´) SP opening = Cu − 0.050 SR opening = Cu + 0.075 2.15 2.55 3.45 3.5 3.3 solder lands solder resist occupied area solder paste 125 μm stencil Dimensions in mm SOT669 Footprint information for reflow soldering sot669_fr REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 06-03-16 11-03-25 02.5 5 mm scale e E1 b c2 A2 A2 bc A e UNIT DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A3 A1 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8ϒ 0ϒ wy D(1) 5.0 4.8 E(1) 3.3 3.1 E1(1) D1(1) max 0.25 4.20 1.27 0.25 0.1 1 23 4 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A A w M C C X 1/2 e yC θ θ (A ) 3 L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 06-03-16 11-03-25 02.5 5 mm scale e E1 b c2 A2 A2 bc A e UNIT DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A3 A1 0.15 0.00 1.20 1.01 0.50 0.35 b2 4.41 3.62 b3 2.2 2.0 b4 0.9 0.7 0.25 0.19 c2 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 L2 0.85 0.40 L 1.3 0.8 L1 8ϒ 0ϒ wy D(1) 5.0 4.8 E(1) 3.3 3.1 E1(1) D1(1) max 0.25 4.20 1.27 0.25 0.1 1 23 4 mounting base D1 c Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E b2 b3 b4 H D L2 L1 A A w M C C X 1/2 e yC θ θ (A ) 3 L A A1 detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.6 (3´) 0.7 (4´) 0.25 (2´) 0.25 (2´) 0.6 (4´) 4.2 4.7 0.25 (2´) 1.27 1.1 2 3.81 0.9 (3´) SP opening = Cu − 0.050 SR opening = Cu + 0.075 2.15 2.55 3.45 3.5 3.3 solder lands solder resist occupied area solder paste 125 μm stencil Dimensions in mm SOT669 Footprint information for reflow soldering sot669_fr Dimensions in mm |
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