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LSF0108 Datasheet(PDF) 206 Page - Nexperia B.V. All rights reserved

Part # LSF0108
Description  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 Datasheet(HTML) 206 Page - Nexperia B.V. All rights reserved

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Nexperia selection guide 2020
206
Minimized outline drawings and reflow soldering footprint
6-pin SMD packages
Dimensions in mm
Images are for reference only, for detailed drawings please visit nexperia.com/packages
DFN2020D-6 (SOT1118D)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT1118D
- - -
sot1118d_po
14-07-16
14-10-16
Unit
mm
max
nom
min
0.65
0.62
0.59
0.04
2.1 0.77 2.1
1.0
0.54 0.30
0.49 0.25
0.44 0.20
0.05
A
Dimensions (mm are the original dimensions)
Note
1. Dimension A is including plating thickness.
A1
bp
0.35
2.0 0.67 2.0
0.9
0.30
1.9 0.57 1.9
0.8
0.25
D
D1
E
E1
e
0.65
e1
Lp
v
0.1
y
y1
0.05
0
1
2 mm
scale
pin 1
index area
cut-off end of
non-fuctional
bonding wire
A
B
D
E
detail X
A1
A
E1
(2x)
Lp
(6x)
e1
e1
pin 1
index area
D1
(2x)
1
3
6
4
bp
(6x)
B
A
v
X
C
y
C
y1
(8x)
solderable lead end
protrusion maximum 0.035 mm (6x)
e
e
DFN2020D-6 (SOT1118D)
DFN2020-6 (SOT1118)
10-05-31
Dimensions in mm
0.04
max
0.65
max
0.77
0.57
(2´)
0.54
0.44
(2´)
2.1
1.9
2.1
1.9
1.1
0.9
0.3
0.2
0.65
(4´)
0.35
0.25
(6´)
4
3
1
6
DFN2020-6 (SOT1118)
Dimensions in mm
solder paste
solder resist
occupied area
solder lands
0.49
0.49
0.65
0.65
0.875
0.875
2.25
0.35
(6´)
0.3
(6´)
0.4
(6´)
0.45
(6´)
0.72
(2´)
0.82
(2´)
1.05
(2´)
1.15
(2´)
2.1
TSSOP6 (SOT363)
TSSOP6 (SOT363)
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35
0.4 (2´)
0.6
(2´)
0.5
(4´)
0.5
(4´)
0.6
(4´)
0.6
(4´)
1.5
1.8
Dimensions in mm
DFN1616-6 (SOT1189-1)
DFN1616-6 (SOT1189-1)
Unit(1)
mm
max
nom
min
0.5 0.05
0.00
0.30
0.25
0.20
1.7
1.6
1.5
1.3
1.2
1.1
1.7
1.6
1.5
0.5
1
0.35
0.30
0.25
0.05
A
Dimensions
A1
A3
0.127
bD
Dh
EEh
0.6
0.5
0.4
ee1
k
0.2
Lv
0.1
w
0.05
y
0.05
y1
01
2 mm
scale
D
E
B
A
terminal 1
index area
X
detail X
A
A1
A3
C
y
C
y1
Dh
Eh
k
L
b
e1
e
A
C
B
v
C
w
terminal 1
index area
4
6
3
1
Unit(1)
mm
max
nom
min
0.5 0.05
0.00
0.30
0.25
0.20
1.7
1.6
1.5
1.3
1.2
1.1
1.7
1.6
1.5
0.5
1
0.35
0.30
0.25
0.05
A
Dimensions
A1
A3
0.127
bD
Dh
EEh
0.6
0.5
0.4
ee1
k
0.2
Lv
0.1
w
0.05
y
0.05
y1
01
2 mm
scale
D
E
B
A
terminal 1
index area
X
detail X
A
A1
A3
C
y
C
y1
Dh
Eh
k
L
b
e1
e
A
C
B
v
C
w
terminal 1
index area
4
6
3
1
DIMENSIONS in mm
By
1.05
P
0.50
Ay
1.85
solder land plus solder paste
occupied area
D
P
Hx
Gx
SPx
Gy
Hy
SLx
Ay By
SLx
SLy
D
0.25
1.3
0.8
SPx
0.4
Gx
Gy
Hx
Hy
1.5
1.85 1.85
2.1
SPy
0.2
SLy
SPy
solder land
solder resist
Issue date 11-06-27
11-07-06
DIMENSIONS in mm
By
1.05
P
0.50
Ay
1.85
solder land plus solder paste
occupied area
D
P
Hx
Gx
SPx
Gy
Hy
SLx
Ay By
SLx
SLy
D
0.25
1.3
0.8
SPx
0.4
Gx
Gy
Hx
Hy
1.5
1.85 1.85
2.1
SPy
0.2
SLy
SPy
solder land
solder resist
Issue date 11-06-27
11-07-06
DIMENSIONS in mm
By
1.05
P
0.50
Ay
1.85
solder land plus solder paste
occupied area
D
P
Hx
Gx
SPx
Gy
Hy
SLx
Ay By
SLx
SLy
D
0.25
1.3
0.8
SPx
0.4
Gx
Gy
Hx
Hy
1.5
1.85 1.85
2.1
SPy
0.2
SLy
SPy
solder land
solder resist
Issue date 11-06-27
11-07-06



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