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LSF0108 Datasheet(PDF) 205 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 205 Page - Nexperia B.V. All rights reserved |
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205 / 234 page  205 DFN1308-6 (SOT8006) Nexperia SOT8006 DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT8006 - - - sot8006_po 19-05-06 Unit mm max nom min 0.23 0.18 0.13 0.18 0.13 0.08 1.40 1.30 1.20 0.90 0.80 0.70 0.45 0.30 0.25 0.20 0.1 0.1 0.05 0.05 0.02 0.00 0.43 0.38 0.33 A Dimensions (mm are the original dimensions) DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm SOT8006 A1 A2 E D b e 0 0.5 scale 1 mm L 0.11 0.08 0.05 G u v y 0.05 y1 L (6x) G x 45° D E A B A C C 1 e 2 3 6 5 4 e A1 seating plane A2 X detail X (optional side view) (6x) pin 1 index area b (6x) A C B v C y1 y Fig. 1. Package outline DFN1308-6 (SOT8006) SOT8006 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 21 May 2019 2 / 5 DFN1308-6 (SOT8006) Nexperia SOT8006 DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 3. Soldering SOT8006 Footprint information for reflow soldering of DFN1308-6 package sot8006_fr Issue date 19-05-06 occupied area 0.4 0.25 0.5 0.15 1.35 0.45 0.45 0.18 0.27 0.28 0.17 1.6 1.05 1.08 solder lands solder resist solder paste Dimensions in mm recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DFN1308-6 (SOT8006) SOT8006 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 21 May 2019 3 / 5 Nexperia SOT8006 DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 3. Soldering SOT8006 Footprint information for reflow soldering of DFN1308-6 package sot8006_fr Issue date 19-05-06 occupied area 0.4 0.25 0.5 0.15 1.35 0.45 0.45 0.18 0.27 0.28 0.17 1.6 1.05 1.08 solder lands solder resist solder paste Dimensions in mm recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DFN1308-6 (SOT8006) SOT8006 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 21 May 2019 3 / 5 Nexperia SOT8006 DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT8006 - - - sot8006_po 19-05-06 Unit mm max nom min 0.23 0.18 0.13 0.18 0.13 0.08 1.40 1.30 1.20 0.90 0.80 0.70 0.45 0.30 0.25 0.20 0.1 0.1 0.05 0.05 0.02 0.00 0.43 0.38 0.33 A Dimensions (mm are the original dimensions) DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm SOT8006 A1 A2 E D b e 0 0.5 scale 1 mm L 0.11 0.08 0.05 G u v y 0.05 y1 L (6x) G x 45° D E A B A C C 1 e 2 3 6 5 4 e A1 seating plane A2 X detail X (optional side view) (6x) pin 1 index area b (6x) A C B v C y1 y Fig. 1. Package outline DFN1308-6 (SOT8006) SOT8006 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 21 May 2019 2 / 5 Minimized outline drawings and reflow soldering footprint Dimensions in mm 6-pin SMD packages XSON6 (SOT886) XSON6 (SOT886) sot886_fr solder resist occupied area solder paste = solderland Dimensions in mm 0.425 (6´) 1.250 0.675 1.700 0.325 (6´) 0.270 (6´) 0.370 (6´) 0.500 0.500 sot886_fr solder resist occupied area solder paste = solderland Dimensions in mm 0.425 (6´) 1.250 0.675 1.700 0.325 (6´) 0.270 (6´) 0.370 (6´) 0.500 0.500 DFN1412-6 (SOT1268-1) NXP Semiconductors SOT1268 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body: 1.4 mm x 1.2 mm x 0.47 mm SOT1268 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved Package information 18 October 2016 2 / 5 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT1268 - - - sot1268_po 16-02-25 16-09-02 Note 1. Dimension A is including plating thickness. 0 1 mm scale detail X pin 1 index area pin 1 index area (2×) B D A A1 E A e1 e e1 e X A B v DFN1412-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body: 1.4 x 1.2 x 0.47 mm SOT1268 Unit(1) mm min nom max 1.35 0.43 0.195 0.145 0.245 A Dimensions (mm are the original dimensions) A1 b 0.15 D D1 e e1 L 0.50 0.47 0.44 0.04 0.00 1.45 1.40 0.53 0.25 0.20 1.15 1.25 E E1 0.32 0.42 0.35 0.5 0.48 1.20 0.37 V Y Y1 0.1 1 3 6 b (6×) 4 E1 (2×) D1 (2×) L (6×) 5 2 0.05 0.05 y C y1 C Fig. 1. Package outline DFN1412-6 (SOT1268) DFN1412-6 (SOT1268-1) NXP Semiconductors SOT1268 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body: 1.4 mm x 1.2 mm x 0.47 mm SOT1268 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved Package information 18 October 2016 3 / 5 3. Soldering SOT1268 Footprint information for reflow soldering of DFN1412-6 package sot1268_fr occupied area solder paste solder resist solder lands Issue date Dimensions in mm 16-04-18 16-09-02 0.2 0.3 0.5 1.3 1.4 1.6 0.25 0.17 1.23 0.43 0.71 1.41 1.51 1.71 0.3 0.35 0.27 0.17 0.37 Fig. 2. Reflow soldering footprint for DFN1412-6 (SOT1268) NXP Semiconductors SOT1268 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body: 1.4 mm x 1.2 mm x 0.47 mm SOT1268 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved Package information 18 October 2016 3 / 5 3. Soldering SOT1268 Footprint information for reflow soldering of DFN1412-6 package sot1268_fr occupied area solder paste solder resist solder lands Issue date Dimensions in mm 16-04-18 16-09-02 0.2 0.3 0.5 1.3 1.4 1.6 0.25 0.17 1.23 0.43 0.71 1.41 1.51 1.71 0.3 0.35 0.27 0.17 0.37 Fig. 2. Reflow soldering footprint for DFN1412-6 (SOT1268) Images are for reference only, for detailed drawings please visit nexperia.com/packages DFN1308-6 (SOT8006B) Nexperia SOT8006B plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT8006B - - - sot8006b_po 18-12-14 Unit mm max nom min 0.23 0.18 0.13 0.18 0.13 0.08 1.40 1.30 1.20 0.90 0.80 0.70 0.45 0.30 0.25 0.20 0.1 0.1 0.05 0.05 0.02 0.00 0.43 0.38 0.33 A Dimensions (mm are the original dimensions) DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm SOT8006B A1 A2 E D b e 0 0.5 scale 1 mm L u v y 0.05 y1 L (6x) D E A B A C C 1 e 2 3 6 5 4 e A1 seating plane A2 X detail X (optional side view) (6x) pin 1 index area b (6x) A C B v C y1 y Fig. 1. Package outline DFN1308-6 (SOT8006B) SOT8006B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 December 2018 2 / 5 DFN1308-6 (SOT8006B) Nexperia SOT8006B plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 3. Soldering SOT8006B Footprint information for reflow soldering of DFN1308-6 package sot8006b_fr Issue date 18-12-14 occupied area 0.4 0.25 0.5 0.15 1.35 0.45 0.45 0.18 0.27 0.28 0.17 1.6 1.05 1.08 solder lands solder resist solder paste Dimensions in mm recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DFN1308-6 (SOT8006B) SOT8006B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 December 2018 3 / 5 Nexperia SOT8006B plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 3. Soldering SOT8006B Footprint information for reflow soldering of DFN1308-6 package sot8006b_fr Issue date 18-12-14 occupied area 0.4 0.25 0.5 0.15 1.35 0.45 0.45 0.18 0.27 0.28 0.17 1.6 1.05 1.08 solder lands solder resist solder paste Dimensions in mm recommend stencil thickness: 0.1 mm Fig. 2. Reflow soldering footprint for DFN1308-6 (SOT8006B) SOT8006B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 December 2018 3 / 5 Nexperia SOT8006B plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT8006B - - - sot8006b_po 18-12-14 Unit mm max nom min 0.23 0.18 0.13 0.18 0.13 0.08 1.40 1.30 1.20 0.90 0.80 0.70 0.45 0.30 0.25 0.20 0.1 0.1 0.05 0.05 0.02 0.00 0.43 0.38 0.33 A Dimensions (mm are the original dimensions) DFN1308-6, plastic, leadless extremely thin small package; 6 terminals; body 1.3 x 0.8 x 0.38 mm SOT8006B A1 A2 E D b e 0 0.5 scale 1 mm L u v y 0.05 y1 L (6x) D E A B A C C 1 e 2 3 6 5 4 e A1 seating plane A2 X detail X (optional side view) (6x) pin 1 index area b (6x) A C B v C y1 y Fig. 1. Package outline DFN1308-6 (SOT8006B) SOT8006B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 19 December 2018 2 / 5 |
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