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LSF0108 Datasheet(PDF) 203 Page - Nexperia B.V. All rights reserved

Part # LSF0108
Description  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 Datasheet(HTML) 203 Page - Nexperia B.V. All rights reserved

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background image
203
TSSOP5 (SOT353)
Dimensions in mm
TSSOP5 (SOT353)
solder lands
solder resist
occupied area
solder paste
sot353_fr
0.4
0.6
0.5
(4´)
0.5
(4´)
0.6
(4´)
0.6
(4´)
2.35
2.65
0.9
0.9
0.75
0.75
Dimensions in mm
Minimized outline drawings and reflow soldering footprint
5-pin SMD packages
TSSOP5 (SOT353-1)
TSSOP5 (SOT353-1)
14-10-01
Dimensions in mm
3
4
5
2
1
1.1
2.25
1.85
0.60
0.15
0.30
0.15
1.3
0.65
2.25
2.00
1.35
1.15
0.46
0.21
0.1
0.0
0.25
0.08
solder lands
solder resist
occupied area
solder paste
sot353_fr
0.4
0.6
0.5
(4´)
0.5
(4´)
0.6
(4´)
0.6
(4´)
2.35
2.65
0.9
0.9
0.75
0.75
Dimensions in mm
TSOP5 (SOT753)
TSOP5 (SOT753)
3.0
2.5
1.7
1.3
3.1
2.7
1.1
0.9
0.26
0.10
0.40
0.25
1.9
0.95
0.6
0.2
13
2
4
5
14-10-03
Dimensions in mm
6-pin SMD packages
XSON6 (SOT1115)
XSON6 (SOT1115)
3
1
2
4
6
5
0.55
1.05
0.95
0.35
max
0.04
max
0.20
0.12
0.40
0.32
0.35
0.27
0.35
0.95
0.85
0.35
10-04-06
Dimensions in mm
SOT1115
Footprint information for reflow soldering of XSON6 package
sot1115_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
10-11-05
17-03-03
0.5
(6x)
0.6
(6x)
0.95
1.4
0.14
(6x)
0.15
(6x)
0.25 (6x)
0.3
0.7
0.3
SOT1115
Footprint information for reflow soldering of XSON6 package
sot1115_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
10-11-05
17-03-03
0.5
(6x)
0.6
(6x)
0.95
1.4
0.14
(6x)
0.15
(6x)
0.25 (6x)
0.3
0.7
0.3
Images are for reference only, for detailed drawings please visit nexperia.com/packages
Dimensions in mm



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