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LSF0108 Datasheet(PDF) 209 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 209 Page - Nexperia B.V. All rights reserved |
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209 / 234 page  209 XQFN8 (SOT902-2) XQFN8 (SOT902-2) 14-09-30 Dimensions in mm 1.65 1.55 0.05 0.00 0.5 0.35 0.25 0.55 1.65 1.55 0.25 0.15 0.5 3 2 1 5 6 7 8 4 SOT902-2 Footprint information for reflow soldering of XQFN8 package sot902-2_fr Issue date 15-06-19 15-06-23 1.9 0.24 0.45 (8x) 0.4 (8x) 0.29 0.37 0.65 1.2 1.75 1 1.2 0.65 1.37 1.75 1.9 0.11 0.32 0. 22 (7x) 0. 27 (8x) occupied area solder paste deposit solder resist solder land solder land plus solder Dimensions in mm SOT902-2 Footprint information for reflow soldering of XQFN8 package sot902-2_fr Issue date 15-06-19 15-06-23 1.9 0.24 0.45 (8x) 0.4 (8x) 0.29 0.37 0.65 1.2 1.75 1 1.2 0.65 1.37 1.75 1.9 0.11 0.32 0. 22 (7x) 0. 27 (8x) occupied area solder paste deposit solder resist solder land solder land plus solder Dimensions in mm Minimized outline drawings and reflow soldering footprint Dimensions in mm 8-pin SMD packages Images are for reference only, for detailed drawings please visit nexperia.com/packages DFN1714-8 (SOT972-2) DFN1714-8 (SOT972-2) Nexperia SOT972-2 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT972-2 - - - - - - - - - sot972-2_po 10-03-23 13-08-02 Unit(1) mm max nom min 0.5 0.05 0.127 1.8 1.7 1.6 1.3 1.2 1.1 1.45 1.35 1.25 0.4 1.2 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions 0.0075 mm maximum per side are not included. DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 A1 b 0.25 0.20 0.15 c D Dh E Eh 0.45 0.40 0.35 e e1 k 0.2 L v 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y C y1 detail X c A A1 terminal 1 index area B A D E b terminal 1 index area e1 e A C B v C w k L Dh Eh 1 6 12 7 0.00 Fig. 1. Package outline DFN1714-8 (SOT972-2) SOT972-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 2 / 5 Nexperia SOT972-2 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT972-2 - - - - - - - - - sot972-2_po 10-03-23 13-08-02 Unit(1) mm max nom min 0.5 0.05 0.127 1.8 1.7 1.6 1.3 1.2 1.1 1.45 1.35 1.25 0.4 1.2 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions 0.0075 mm maximum per side are not included. DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 A1 b 0.25 0.20 0.15 c D Dh E Eh 0.45 0.40 0.35 e e1 k 0.2 L v 0.1 w 0.05 y 0.05 y1 0 1 2 mm scale X C y C y1 detail X c A A1 terminal 1 index area B A D E b terminal 1 index area e1 e A C B v C w k L Dh Eh 1 6 12 7 0.00 Fig. 1. Package outline DFN1714-8 (SOT972-2) SOT972-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 2 / 5 Nexperia SOT972-2 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT972-2 DIMENSIONS in mm Footprint information for reflow soldering of DFN1714-8 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy 0.780 0.220 1.400 0.400 P 0.400 Ay 1.780 1.630 1.700 1.910 1.990 SPx SPy 0.500 SPx tot 0.500 0.300 nSPx nSPy 1 1 SPy tot 0.300 solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPy SPy tot SLy By Ay nSPx SPx tot SPx SLx 0.05 0.05 sot972-2_fr Issue date 12-08-28 13-08-02 Fig. 2. Reflow soldering footprint for DFN1714-8 (SOT972-2) SOT972-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT972-2 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT972-2 DIMENSIONS in mm Footprint information for reflow soldering of DFN1714-8 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy 0.780 0.220 1.400 0.400 P 0.400 Ay 1.780 1.630 1.700 1.910 1.990 SPx SPy 0.500 SPx tot 0.500 0.300 nSPx nSPy 1 1 SPy tot 0.300 solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPy SPy tot SLy By Ay nSPx SPx tot SPx SLx 0.05 0.05 sot972-2_fr Issue date 12-08-28 13-08-02 Fig. 2. Reflow soldering footprint for DFN1714-8 (SOT972-2) SOT972-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT972-2 plastic, leadless thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.5 mm body 3. Soldering SOT972-2 DIMENSIONS in mm Footprint information for reflow soldering of DFN1714-8 package Generic footprint pattern Refer to the package outline drawing for actual layout By D Slx Sly Gx Gy Hx Hy 0.780 0.220 1.400 0.400 P 0.400 Ay 1.780 1.630 1.700 1.910 1.990 SPx SPy 0.500 SPx tot 0.500 0.300 nSPx nSPy 1 1 SPy tot 0.300 solder land plus solder paste occupied area solder land solder paste deposit solder resist D P Gx Gy Hx Hy SPy SPy tot SLy By Ay nSPx SPx tot SPx SLx 0.05 0.05 sot972-2_fr Issue date 12-08-28 13-08-02 Fig. 2. Reflow soldering footprint for DFN1714-8 (SOT972-2) SOT972-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 VSSOP8 (SOT765-1) VSSOP8 (SOT765-1) 14-10-01 Dimensions in mm 14 8 5 0.23 0.08 0.27 0.17 0.5 2.1 1.9 2.4 2.2 3.2 3.0 1.0 max 0.40 0.15 0.15 0.00 SOT765-1 Footprint information for reflow soldering of VSSOP8 package sot765-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.55 0.125 0.5 2.1 2.25 3.075 0.125 2.0 3.75 1.75 3.5 0.3 0.2 0.4 0.3 0.2 0.85 0.75 SOT765-1 Footprint information for reflow soldering of VSSOP8 package sot765-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.55 0.125 0.5 2.1 2.25 3.075 0.125 2.0 3.75 1.75 3.5 0.3 0.2 0.4 0.3 0.2 0.85 0.75 LFPAK33 (SOT1210) LFPAK33 (SOT1210) References Outline version European projection Issue date IEC JEDEC JEITA SOT1210 sot1210_po 12-03-12 14-04-25 Unit(1) mm max nom min 0.90 0.10 0.35 0.20 0.30 2.70 0.65 A Dimensions Note 1. Plastic or metal protrusions of 0.15 mm per side are not included. A1 b 0.35 b1 c c1 D(1) θ D1 E(1) E1 e 0.65 0.50 e1 H 3.40 2.45 2.35 3.40 L 0.25 Lp 0.50 0.20 0.10 w y 3.20 2.00 0.80 0.00 0.25 0.10 0.20 2.50 0.25 0° 1.90 D2 3.20 0.13 0.30 8° 0 5 mm 2.5 scale A e1 e X θ w A mounting base E1 c1 b1 b A E L D1 D2 H D detail X C c A1 C y 1 4 |
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