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LSF0108 Datasheet(PDF) 211 Page - Nexperia B.V. All rights reserved

Part # LSF0108
Description  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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Manufacturer  NEXPERIA [Nexperia B.V. All rights reserved]
Direct Link  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 Datasheet(HTML) 211 Page - Nexperia B.V. All rights reserved

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211
SO8 (SOT96-1)
SO8 (SOT96-1)
sot096-1_fr
occupied area
solder lands
Dimensions in mm
placement accuracy ± 0.25
1.30
0.60 (8×)
1.27 (6×)
4.00 6.60
5.50
7.00
sot096-1_fr
occupied area
solder lands
Dimensions in mm
placement accuracy ± 0.25
1.30
0.60 (8×)
1.27 (6×)
4.00 6.60
5.50
7.00
Dimensions in mm
Minimized outline drawings and reflow soldering footprint
10-pin SMD packages
8-pin SMD packages
DFN2510-10 (SOT1165-1)
DFN2510-10 (SOT1165-1)
SOT1165-1
Remark:
Stencil of 75 m is recommended.
A stencil of 75 m gives an aspect ratio of 0.77
With a stencil of 100 m one will obtain an aspect ratio of 0.58
Footprint information for reflow soldering of XSON10 package
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
Dimensions in mm
Ay
By
CD
Hy
1.3
0.25 0.525 0.20
D1
0.40
P
0.500
1.6
Hx
2.45
Generic footprint pattern
Refer to the package outline drawing for actual layout
sot1165-1_fr
Hx
By
Hy
0.05
C
P
D
0.05
D1
Ay
Unit
mm
max
nom
min
0.5 0.05
0.00
0.25
0.20
0.15
0.4
2.6
2.5
2.4
1.1
1.0
0.9
0.2
0.43
0.38
0.33
0.05
A
Dimensions
A1
c
0.127
bb1
D(1) E(1)
e
0.5
e1
2
kL
v
0.1
wy
0.05
y1
0.05
01
2 mm
scale
X
C
y
C
y1
B
A
terminal 1
index area
D
E
detail X
A
c
A1
b
k
L
b1
e1
e
A
C
B
v
C
w
terminal 1
index area
10
6
Terminal#3 identification
5
1
SOT1165-1
Remark:
Stencil of 75 m is recommended.
A stencil of 75 m gives an aspect ratio of 0.77
With a stencil of 100 m one will obtain an aspect ratio of 0.58
Footprint information for reflow soldering of XSON10 package
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
Dimensions in mm
Ay
By
CD
Hy
1.3
0.25 0.525 0.20
D1
0.40
P
0.500
1.6
Hx
2.45
Generic footprint pattern
Refer to the package outline drawing for actual layout
sot1165-1_fr
Hx
By
Hy
0.05
C
P
D
0.05
D1
Ay
SOT1165-1
Remark:
Stencil of 75 m is recommended.
A stencil of 75 m gives an aspect ratio of 0.77
With a stencil of 100 m one will obtain an aspect ratio of 0.58
Footprint information for reflow soldering of XSON10 package
solder land plus solder paste
occupied area
solder land
solder paste deposit
solder resist
Dimensions in mm
Ay
By
CD
Hy
1.3
0.25 0.525 0.20
D1
0.40
P
0.500
1.6
Hx
2.45
Generic footprint pattern
Refer to the package outline drawing for actual layout
sot1165-1_fr
Hx
By
Hy
0.05
C
P
D
0.05
D1
Ay
XQFN10 (SOT1160-1)
XQFN10 (SOT1160-1)
SOT1160-1
Footprint information for reflow soldering of XQFN10 package
sot1160-1_fr
occupied area
solder land
placement area
solder resist, 0.0625 around copper
solder land plus solder paste
Dimensions in mm
clearance, 0.125 around occupied area
0.5
CU
1
CU
2.1
CU
0.22
CU (10×)
0.85
0.4
(6×)
0.45
1.25
1.7 CU
1.95
2.35
0.6
CU
solder paste deposit, -0.02 around copper,
stencil thickness 0.1
SOT1160-1
Footprint information for reflow soldering of XQFN10 package
sot1160-1_fr
occupied area
solder land
placement area
solder resist, 0.0625 around copper
solder land plus solder paste
Dimensions in mm
clearance, 0.125 around occupied area
0.5
CU
1
CU
2.1
CU
0.22
CU (10×)
0.85
0.4
(6×)
0.45
1.25
1.7 CU
1.95
2.35
0.6
CU
solder paste deposit, -0.02 around copper,
stencil thickness 0.1
09-12-29
Dimensions in mm
1.9
1.7
0.45
0.33
0.4
0.5
0.05
0.00
1.5
1.3
0.8
1.4
0.25
0.15
0.4
5
10
8
6
7
2
1
3
X2QFN10 (SOT1430-1)
X2QFN10 (SOT1430-1)
SOT1430-1
Footprint information for reflow soldering of XSON8 package
sot1430-1_fr
Issue date 18-10-09
18-10-10
Dimensions in mm
occupied area
solder paste
solder resist
solder lands
0.18
0.05 0.02
0.62
2.25
0.4
0.45
(6×)
1.0
1.9
0.05
0.4
0.4
0.02
0.18
0.22
(10×)
1.02
0.7
0.3
0.4
1.6
0.6 (3×)
1.95
recommended stencil thickness: 0.1 mm
SOT1430-1
Footprint information for reflow soldering of XSON8 package
sot1430-1_fr
Issue date 18-10-09
18-10-10
Dimensions in mm
occupied area
solder paste
solder resist
solder lands
0.18
0.05 0.02
0.62
2.25
0.4
0.45
(6×)
1.0
1.9
0.05
0.4
0.4
0.02
0.18
0.22
(10×)
1.02
0.7
0.3
0.4
1.6
0.6 (3×)
1.95
recommended stencil thickness: 0.1 mm
15-02-10
Dimensions in mm
0.33
max
0.05
0.00
1.65
1.55 0.4
0.15
min
0.8
1.35
1.25
0.65
0.55
0.35
0.25
10
98
34
5
7
6
1
2
Images are for reference only, for detailed drawings please visit nexperia.com/packages



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