LP3995 datasheet(3/26 Pages) TI2

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1 IN

2 GND

3 EN

OUT 6

BYPASS 4

N/C 5

Device

Code

IN 1

GND 2

EN 3

6 OUT

4 BYPASS

5 N/C

PAD

GND

PAD

GND

BYPASS

GND

OUT

BYPASS

GND

OUT

LP3995

www.ti.com

SNVS179F – FEBRUARY 2003 – REVISED SEPTEMBER 2015

5 Pin Configuration and Functions

YZR Package

5-Pin DSBGA

Top View

NGD Package

6-Pin WSON

Top View

Pin Functions

TYPE

DESCRIPTION

NAME

WSON

DSBGA

Bypass capacitor connection.

BYPASS

—

Connect a 0.01-µF capacitor for noise reduction.

Enable input; Disables the regulator when

≤ 0.4 V.

Input

Enables the regulator when

≥ 0.9 V.

GND

Ground

Common ground

The exposed thermal pad on the bottom of the WSON package should be

connected to a copper thermal pad on the PCB under the package. The use of

thermal vias to remove heat from the package into the PCB is recommended.

Thermal

Connect the exposed thermal pad to ground potential or leave floating. Do not

GND

—

Ground

Pad

connect the thermal pad to any potential other than the same ground potential

seen at device pin 2. For additional information on using TI's non pull-back WSON

package, see TI Application Note AN- 1187 Leadless Leadframe Package (LLP)

(SNOA401).

Input

Voltage supply input

N/C

—

No internal connection. This pin can be connected to GND, or left open.

OUT

Output

Voltage output. Connect this output to the load circuit.

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