THERMAL CHARACTERISTICS

(1)

RECOMMENDED OPERATING CONDITIONS

ADS5463

ADS54RF63

www.ti.com ................................................................................................................................................... SLAS515E – NOVEMBER 2006 – REVISED JULY 2009

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

23.7

RθJA

(2)

Soldered thermal pad, 150-LFM airflow

17.8

°C/W

Soldered thermal pad, 250-LFM airflow

16.4

RθJP

(3)

Bottom of package (thermal pad)

2.99

°C/W

(1)

Using 36 thermal vias (6 × 6 array). See PowerPAD Package in the Application Information section.

(2)

RθJA is the thermal resistance from the junction to ambient.

(3)

RθJP is the thermal resistance from the junction to the thermal pad.

ADS54RF63

ADS5463

UNIT

MIN

NOM

MAX

MIN

NOM

MAX

TA

Open free-air temperature

–40

85

–40

85

°C

SUPPLIES

AVDD5

Analog supply voltage

4.75

5

5.25

4.75

5

5.25

V

AVDD3

Analog supply voltage

3.0

3.3

3.6

3.0

3.3

3.6

V

DVDD3 Output driver supply voltage

3.0

3.3

3.6

3.0

3.3

3.6

V

ANALOG INPUT

Differential input range

2.2

2.2

Vpp

VCM

Input common mode

2.4

2.4

V

DIGITAL OUTPUT (DRY, DATA, OVR)

Maximum differential output load

10

10

pF

CLOCK INPUT (CLK)

CLK input sample rate (sine wave)

40

550

20

500

MSPS

Clock amplitude, differential sine wave, see

0.5

3.5

0.5

3.5

Vpp

Figure 59

Clock duty cycle, see Figure 64

40%

50%

60%

40%

50%

60%

Copyright © 2006–2009, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Link(s): ADS5463 ADS54RF63