6.9 Electrical Characteristics (continued)

minimum and maximum specifications apply from TA = –40°C to +125°C, VDD = 3.0 V to 5.5 V, INP = –50 mV to +50 mV,

INN = HGND = 0 V, and the external components listed in the Typical Application section; typical specifications are at TA =

25°C, and VDD = 3.3 V (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY

IDD

Low-side supply current

no external load on HLDO

27.5

40

mA

1 mA external load on HLDO

29.5

42

VDDUV

VDD analog undervoltage detection

threshold

VDD rising

2.9

V

VDD falling

2.8

VDDPOR

VDD digital reset threshold

VDD rising

2.5

V

VDD falling

2.4

VDCDC_OUT DCDC output voltage

DCDC_OUT to HGND

3.1

3.5

4.65

V

VDCDCUV

DCDC output undervoltage detection

threshold voltage

DCDC output falling

2.1

2.25

V

VHLDO_OUT High-side LDO output voltage

HLDO to HGND, up to 1 mA external

load

3

3.2

3.4

V

VHLDOUV

High-side LDO output undervoltage

detection threshold voltage

HLDO output falling

2.4

2.6

V

IH

High-side supply current for auxiliary

circuitry

Load connected from HLDO_OUT to

HGND, non-switching

1

mA

tAS

Analog settling time

VDD step to 3.0 V, to OUTP and

OUTN valid, 0.1% settling

0.9

1.4

ms

(1)

The typical value includes one standard deviation ("sigma") at nominal operating conditions.

(2)

This parameter is input referred.

(3)

THD is the ratio of the rms sum of the amplitues of first five higher harmonics to the amplitude of the fundamental.

(4)

Offset error temperature drift is calculated using the box method, as described by the following equation:

TCVOS = (ValueMAX - ValueMIN) / TempRange

(5)

Gain error temperature drift is calculated using the box method, as described by the following equation:

TCEG (ppm) = (ValueMAX - ValueMIN) / (Value(T=25℃) x TempRange) x 106

6.10 Switching Characteristics

over operating ambient temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

tr

Output signal rise time

1.3

µs

tf

Output signal fall time

1.3

µs

VINx to VOUTx signal delay (50% – 10%)

Unfiltered output

1.2

1.5

µs

VINx to VOUTx signal delay (50% – 50%)

Unfiltered output

1.6

2.1

µs

VINx to VOUTx signal delay (50% – 90%)

Unfiltered output

2.3

3

µs

www.ti.com

AMC3302

SBASA11B – AUGUST 2020 – REVISED JULY 2021

Copyright © 2021 Texas Instruments Incorporated

Submit Document Feedback

9

Product Folder Links: AMC3302