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PACKAGE OUTLINE

C

6.2

5.8

TYP

1.7 MAX

6X 1.27

8X

0.51

0.31

2X

3.81

0.25

0.10

TYP

0 - 8

0.15

0.00

2.71

2.11

3.4

2.8

4X (0 -10 )

0.25

GAGE PLANE

1.27

0.40

A

5.0

4.8

NOTE 3

B

4.0

3.8

4214849/B 09/2025

PowerPAD

SOIC - 1.7 mm max height

DDA0008B

PLASTIC SMALL OUTLINE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MS-012.

PowerPAD is a trademark of Texas Instruments.

TM

1

8

0.25

C A B

5

4

PIN 1 ID

AREA

NOTE 4

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.400

EXPOSED

THERMAL PAD

4

1

5

8

9