BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer

1 Features

• Pin-Selected Bandwidth: 35 MHz to 210 MHz

• High Output Current: 250 mA

• Slew Rate: 3750 V/µs

• Low Quiescent Current: 1.5 mA (35-MHz BW)

• Wide Supply Range: ±2.25 V to ±18 V

• Internal Output Current Limit

• Thermal Shutdown Protection

• Available in Packages with Thermal Pad

• Extended Temperature Operation:

–40°C to +125°C

2 Applications

• Memory, Semiconductor Testers

• Test Equipment

• Headphone Drivers

• Flight Control Systems

• Capacitive Load Drivers

• Valve Drivers, Solenoid Drivers

• Line Drivers

3 Description

The BUF634A device is a high-performance, high-

fidelity, open-loop buffer that is capable of driving 250

mA of output current. The BUF634A is a 36-V device

with an adjustable bandwidth of 35 MHz to 210 MHz,

which is accomplished by varying the value of an

external resistor between the V– and BW pins.

The BUF634A device can be used as a standalone

open-loop driver, or used inside the feedback loop of

a precision op amp to provide both high-precision and

large output current drive with improved capacitive

load drive.

For low-power applications, the BUF634A device

operates on a 1.5-mA quiescent current with a

250-mA output, 3750-V/µs slew rate, and 35-MHz

bandwidth. The device consumes 8.5-mA quiescent

current in wide-bandwidth mode with a 210-MHz

bandwidth. The BUF634A is fully protected by an

internal current limit in its output stage and by thermal

shutdown, making the device rugged and easy to use.

The BUF634A device is rated to function over the

extended industrial temperature range of –40°C to

+125°C. The BUF634A comes in three packages: D

(SOIC), DRB (VSON), and DDA (HSOIC). The DRB

(VSON) and DDA (HSOIC) packages have excellent

thermal performance resulting from the thermal pad

on the bottom side. The DRB package comes in a

very small form factor of 3.0 mm × 3.0 mm, making

the device a very suitable option for portable and size-

constrained applications.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

BUF634A

SOIC (8)

4.90 mm × 3.90 mm

VSON (8)

3.00 mm × 3.00 mm

HSOIC (8)

4.90 mm × 3.90 mm

(1)

For all available packages, see the orderable addendum at

the end of the data sheet.

±

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1 kQ

1 kQ

V+

V

O

V

IN

Boost the Output Current of Any Operational

Amplifier

Top layer Cu Area (cm2)

0

5

10

15

20

25

30

35

0

20

40

60

80

100

D037

TJA (°C/W) 4 Layer Board

<JB (°C/W) 4 Layer Board

TJA (°C/W) 2 Layer Board

<JB (°C/W) 2 Layer Board

Thermal Performance vs Cu Area for the DDA

Package

BUF634A

SBOS948F – FEBRUARY 2019 – REVISED MAY 2021

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.