6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Vs

Supply voltage

–0.3

22

V

VIN+, VIN– (2)

Analog inputs, differential (VIN+) – (VIN–)

–30

30

V

Analog inputs, common mode (VIN+ or VIN-)

–20

122

VOUTx

Analog outputs, output voltage

GND – 0.3

Vs + 0.3

V

TA

Operating temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the VIN+ and VIN– pins, respectively.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range(1)

VS

48

120

V

VS

Operating supply range

2.7

5

20

V

TA

Ambient temperature

–40

125

°C

(1)

Common-mode voltage can go below VS under certain conditions. See Figure 7-1 for additional information on operating range.

6.4 Thermal Information

THERMAL METRIC(1)

INA4290

INA2290

INA290

UNIT

RGV (QFN)

DGK (VSSOP)

DCK (SC-70)

16 PINS

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

45.9

169.3

191.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.6

60.1

144.4

°C/W

RθJB

Junction-to-board thermal resistance

21.0

91.3

69.2

°C/W

ΨJT

Junction-to-top characterization parameter

1.0

8.3

46.2

°C/W

ΨJB

Junction-to-board characterization parameter

21.0

89.7

69.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

6.4

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

INA290, INA2290, INA4290

SBOS961C – JUNE 2020 – REVISED JUNE 2021

Copyright © 2021 Texas Instruments Incorporated

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