LM140K

SNVS994 – JULY 2013

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Connection Diagrams

Figure 4. TO-3 Metal Can (Bottom View)

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

DC Input Voltage

35V

Internal Power Dissipation(4)

Internally Limited

Maximum Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec.)

TO-3 Package (NDS)

300°C

ESD Susceptibility(5)

2 kV

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which

the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical

Characteristics.

(2)

Specifications and availability for military grade LM140H/883 and LM140K/883 can be found in the LM140QML datasheet (SNVS382).

Specifications and availability for military and space grade LM140H/JAN and LM140K/JAN can be found in the LM140JAN datasheet

(SNVS399).

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(4)

The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation

(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX −

TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die

temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal

resistance (

θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3

package and the case-to-ambient thermal resistance of the heatsink.

(5)

ESD rating is based on the human body model, 100 pF discharged through 1.5 k

Ω.

Operating Conditions

(1)

Temperature Range (TA)

(2)

LM140

−55°C to +125°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which

the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical

Characteristics.

(2)

The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation

(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX −

TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die

temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal

resistance (

θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3

package and the case-to-ambient thermal resistance of the heatsink.

2

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