7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD

Supply voltage

–0.5

3.6

V

VCLKIN

Input voltage (CLKIN)

VIN

Input voltage (1G)

VYn

Output pins (Yn)

–0.5

VDD + 0.3

IIN

Input current

–20

20

mA

IO

Continuous output current

–50

50

mA

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±9000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Core supply voltage

3.3-V supply

3.135

3.3

3.465

V

2.5-V supply

2.375

2.5

2.625

1.8-V supply

1.71

1.8

1.89

TA

Operating free-air temperature

–40

125

°C

TJ

Operating junction temperature

–40

150

°C

7.4 Thermal Information

THERMAL METRIC(1)

LMK1C1104

UNIT

DQF(WSON)

PW (TSSOP)

8 PINS

8 PINS

RqJA

Junction-to-ambient thermal resistance

163

181.9

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

105.7

76.6

°C/W

RqJB

Junction-to-board thermal resistance

84.2

111.6

°C/W

YJT

Junction-to-top characterization parameter

16.7

16

°C/W

YJB

Junction-to-board characterization parameter

83.9

110.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

LMK1C1102, LMK1C1103, LMK1C1104

SNAS791D – DECEMBER 2019 – REVISED FEBRUARY 2022

Copyright © 2022 Texas Instruments Incorporated

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