VIN

CIN

COUT

SNS

OUT

Power

Ground

1

2

3

4

5

6

Thermal

Pad

N/C

IN

IN

COUT

SNS

OUT

CIN

Power

Ground

1

2

3

4

5

6

Thermal

Pad

EN

IN

IN

COUT

VOUT

CIN

Power Ground

VIN

IN

OUT

COUT

VOUT

CIN

Power

Ground

VIN

EN

NC

OUT

IN

GND

19

LP38690, LP38692

www.ti.com

SNVS322M – DECEMBER 2004 – REVISED DECEMBER 2015

Product Folder Links: LP38690 LP38692

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Copyright © 2004–2015, Texas Instruments Incorporated

10.2 Layout Examples

Figure 35. LP38690 TO-252 Package

Figure 36. LP38692 SOT-223 Package

Figure 37. LP38690 WSON Package

Figure 38. LP38692 WSON Package

10.3 WSON Mounting

The NGG0006A (No Pullback) 6-Lead WSON package requires specific mounting techniques which are detailed

in the TI Application Report AN-1187 Leadless Leadframe Package (LLP) (SNOA401). Referring to the section

PCB Design Recommendations (Page 5), it should be noted that the pad style which should be used with the

WSON package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal

pads to be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and inspection.

The input current is split between two IN pins, 1 and 6. The two IN pins must be connected together to ensure

that the device can meet all specifications at the rated current.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive

die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN

junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be

connected directly to the ground at device lead 2 (such as GND). Alternately, but not recommended, the DAP

may be left floating (that is, no electrical connection). The DAP must not be connected to any potential other than

ground.