LP5907 datasheet(5/50 Pages) TI2

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5.4 Thermal Information

THERMAL METRIC(1)

LP5907

UNIT

DBV

(SOT-23)

DQN

(X2SON)

YCR

(DSBGA)

YKE

(DSBGA)

YKG

(DSBGA)

YKM

(DSBGA)

5 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

193.4

216.1

189.4

206.1

191.6

194.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

102.1

161.7

2.4

1.5

2.4

3.0

°C/W

RθJB

Junction-to-board thermal resistance

45.8

162.1

56.6

37.0

58.9

62.7

°C/W

ψJT

Junction-to-top characterization parameter

8.4

5.1

1.1

15.0

1.1

°C/W

ψJB

Junction-to-board characterization parameter

45.3

161.7

56.5

36.8

58.9

62.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

123.0

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics

VIN = VOUT(NOM) + 1V, VEN = 1.2V, IOUT = 1mA, CIN = 1µF, and COUT = 1µF (unless otherwise noted)(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage

TA = 25°C

2.2

5.5

ΔVOUT

Output voltage tolerance

VIN = (VOUT(NOM) + 1V) to 5.5V,

IOUT = 1mA to 250mA

–2

%VOUT

VIN = (VOUT(NOM) + 1V) to 5.5V,

IOUT = 1mA to 250mA

(VOUT < 1.8V, SOT-23, X2SON packages)

–3

Line regulation

VIN = (VOUT(NOM) + 1V) to 5.5V,

IOUT = 1mA

0.02

%/V

Load regulation

IOUT = 1mA to 250mA

0.001

%/mA

ILOAD

Load current

See(4)

250

Maximum output current

250

Quiescent current(5)

VEN = 1.2V, IOUT = 0mA

μA

VEN = 1.2V, IOUT = 250mA

250

425

VEN = 0.3V (disabled)

0.2

Ground current(6)

VEN = 1.2V, IOUT = 0mA

μA

VDO

Dropout voltage(7)

IOUT = 100mA

IOUT = 250mA (DSBGA package)

120

200

IOUT = 250mA (SOT-23, X2SON packages)

250

ISC

Short-circuit current limit

TA = 25°C(8)

250

500

PSRR

Power-supply rejection ratio(9)

f = 100Hz, IOUT = 20mA

f = 1kHz, IOUT = 20mA

f = 10kHz, IOUT = 20mA

f = 100kHz, IOUT = 20mA

Output noise voltage(9)

BW = 10Hz to 100kHz

IOUT = 1mA

µVRMS

IOUT = 250mA

6.5

RAD

Output automatic discharge

pulldown resistance

VEN < VIL (output disabled)

230

TSD

Thermal shutdown

TJ rising

160

°C

Thermal hysteresis

TJ falling from shutdown

LOGIC INPUT THRESHOLDS

www.ti.com

LP5907

SNVS798Q – APRIL 2012 – REVISED JULY 2025

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