5.5 Electrical Characteristics (continued)

VIN = VOUT(NOM) + 1V, VEN = 1.2V, IOUT = 1mA, CIN = 1µF, and COUT = 1µF (unless otherwise noted)(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIL

Low input threshold

VIN = 2.2V to 5.5V,

VEN falling until the output is disabled

0.4

V

VIH

High input threshold

VIN = 2.2V to 5.5V

VEN rising until the output is enabled

1.2

V

IEN

Input current at EN pin(10)

VEN = 5.5V and VIN = 5.5V

5.5

μA

VEN = 0V and VIN = 5.5V

0.001

TRANSIENT CHARACTERISTICS

ΔVOUT

Line transient(9)

VIN = (VOUT(NOM) + 1V) to

(VOUT(NOM) + 1.6V) in 30µs

–1

mV

VIN = (VOUT(NOM) + 1.6V) to

(VOUT(NOM) + 1.6V) in 30µs

1

Load transient(9)

IOUT = 1mA to 250mA in 10µs

–40

IOUT = 250mA to 1mA in 10µs

40

Overshoot on start-up(9)

Stated as a percentage of VOUT(NOM)

5%

Overshoot on start-up with EN(9)

Stated as a percentage of VOUT(NOM), VIN =

VOUT + 1V to 5.5V, 0.7µF < COUT < 10µF, 0mA

< IOUT < 250mA, EN rising until the output is

enabled

1%

tON

Turn-on time

From VEN > VIH to VOUT = 95% of VOUT(NOM),

TA = 25°C

80

150

µs

(1)

All voltages are with respect to the device GND terminal, unless otherwise stated.

(2)

Minimum and maximum limits are specified through test, design, or statistical correlation over the junction temperature (TJ) range of

–40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for

reference purposes only.

(3)

In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature can

possibly have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature

(TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal

resistance of the device or package in the application RθJA ), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

See the Application and Implementation section.

(4)

The device maintains a stable, regulated output voltage without a load current.

(5)

Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.

(6)

Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.

(7)

Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100mV below the

nominal value.

(8)

Short-circuit current (ISC) for the LP5907 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured with

VOUT pulled to 100mV below the nominal voltage.

(9)

This specification is verified by design.

(10) There is a 1MΩ resistor between EN and ground on the device.

5.6 Output and Input Capacitors

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN(1)

TYP

MAX

UNIT

CIN

Input capacitance(2)

Capacitance for stability

0.7

1

µF

COUT

Output capacitance(2)

0.7

1

10

µF

ESR

Output/input capacitance(2)

5

500

mΩ

(1)

The minimum capacitance must be greater than 0.7µF over the full range of operating conditions. The capacitor tolerance must be

30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application must be

considered during device selection to make sure this minimum capacitance specification is met. X7R capacitors are recommended,

however capacitor types X5R, Y5V, and Z5U can be used with consideration of the application and conditions.

(2)

This specification is verified by design.

LP5907

SNVS798Q – APRIL 2012 – REVISED JULY 2025

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