4

OPA188

SBOS642C – MARCH 2013 – REVISED JANUARY 2020

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current-limited to 10 mA or less.

(3)

Short-circuit to ground, V-, or V+.

(4)

Provided device does not exceed maximum junction temperature (TJ) at any time.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

Supply

Split supply

±20

V

Single supply

40

Signal input pins(2)

(V–) – 0.5

(V+) + 0.5

Differential

±0.7

Current

Signal input pins(2)

±10

mA

Output short-circuit(3)

Continuous

Temperature

Operating(4), TA

–55

150

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Operating voltage range

Split supply

±2

±18

V

Single supply

4

36

TA

Specified temperature range

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

OPA188

UNIT

D (SO)

DBV (SOT23)

DGK (MSOP)

8 PINS

5 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

122.0

158.8

180.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

68.5

60.7

67.9

°C/W

RθJB

Junction-to-board thermal resistance

63.5

44.8

102.1

°C/W

ψJT

Junction-to-top characterization parameter

13.7

1.6

10.4

°C/W

ψJB

Junction-to-board characterization parameter

62.8

44.2

100.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W